Investigation on fracture behavior of ferroelectric ceramics under combined electromechanical combined loading by using a moire interferometry technique

Q. D. Bing; D. N. Fang

doi:10.1117/12.468822

29 May 2002 Investigation on fracture behavior of ferroelectric ceramics under combined electromechanical combined loading by using a moire interferometry technique

Q. D. Bing, D. N. Fang

Author Affiliations +

Proceedings Volume 4537, Third International Conference on Experimental Mechanics; (2002) https://doi.org/10.1117/12.468822
Event: Third International Conference on Experimental Mechanics, 2002, Beijing, China

Abstract

This paper introduces how to in situ observe fracture behavior around crack tip in ferroelectric ceramics under combined electromechanical loading by use of a moire interferometry technique. The deformation field induced by electric field concentration near crack tip in three-points bending experiments was measured. By analyzing the moire interferometry images it is found that strain decreases faster than values predicted by the theoretical analysis as the distance away from the crack tip increases.

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Q. D. Bing and D. N. Fang "Investigation on fracture behavior of ferroelectric ceramics under combined electromechanical combined loading by using a moire interferometry technique", Proc. SPIE 4537, Third International Conference on Experimental Mechanics, (29 May 2002); https://doi.org/10.1117/12.468822

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