Toward the micromachined vibrating gyroscope using (111) silicon wafer process

Jerwei Hsieh; Wen-Chih Chen; Weileun Fang

doi:10.1117/12.442961

28 September 2001 Toward the micromachined vibrating gyroscope using (111) silicon wafer process

Jerwei Hsieh, Wen-Chih Chen, Weileun Fang

Author Affiliations +

Proceedings Volume 4557, Micromachining and Microfabrication Process Technology VII; (2001) https://doi.org/10.1117/12.442961
Event: Micromachining and Microfabrication, 2001, San Francisco, CA, United States

Abstract

The issues regarding structure design and fabrication in improving the performance of MVGs are discussed. Although using (111) Si wafer with existing HARM process is appropriate, some limitations on design and fabrication still exist. This study proposes a novel BELST process that can improve the device performance as well as fabrication capability of the existing techniques. The salient features of the process are described, and various design concepts have been demonstrated from the fabrication results. According to the result, MVGs with desired shape and thickness can easily be obtained using the developed BELST process.

Citation Download Citation

Jerwei Hsieh, Wen-Chih Chen, and Weileun Fang "Toward the micromachined vibrating gyroscope using (111) silicon wafer process", Proc. SPIE 4557, Micromachining and Microfabrication Process Technology VII, (28 September 2001); https://doi.org/10.1117/12.442961

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