Packaging solutions for MEMS/MOEMS using thin films as mechanical components

P. Boyle; Richard R. A. Syms; David F. Moore

doi:10.1117/12.462848

19 April 2002 Packaging solutions for MEMS/MOEMS using thin films as mechanical components

P. Boyle, Richard R. A. Syms, David F. Moore

Proceedings Volume 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002; (2002) https://doi.org/10.1117/12.462848
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, 2002, Cannes-Mandelieu, France

Abstract

Optoelectronic subsystems are becoming increasingly important to reduce the costs of assembly and packaging. The mechanical properties of vapor-deposited thin films can be used to advantage; for example three-micrometer thick silicon nitride microclips to hold single mode optic fibers in place in silicon V-shaped grooves. This paper describes the proposed use of pairs of thin film microcantilevers to precisely locate an optic component such as a filter or a mirror in an optical bench. In this configuration the precision of the lithographic process for the cantilevers determines the exact location of the component in the package, and to first order the etched shape in the substrate is unimportant. Simulation software based on variational principles has been developed to examine the behavior of structures undergoing large-scale elastic deflections. The design software consists of spreadsheet front end to enter parameters, and then Visual Basic (VBA) code and Frontline 'solver' software to run simulations. The fabrication process is described for 5 micrometers thick silicon carbide beams which are then tested by bending them using a surface profiler (such as a Dektak) to deflect the fifty micrometer wide silicon nitride cantilevers through large angles. The possible consequences for more efficient optoelectronic packaging are briefly assessed.

Citation Download Citation

P. Boyle, Richard R. A. Syms, and David F. Moore "Packaging solutions for MEMS/MOEMS using thin films as mechanical components", Proc. SPIE 4755, Design, Test, Integration, and Packaging of MEMS/MOEMS 2002, (19 April 2002); https://doi.org/10.1117/12.462848

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available