Paper
18 October 2002 Three-dimensional vision sensor with multiple CCD cameras
Seiji Hata, Daisuke Shima, Kan'ichi Kaida
Author Affiliations +
Proceedings Volume 4902, Optomechatronic Systems III; (2002) https://doi.org/10.1117/12.468381
Event: Optomechatronic Systems III, 2002, Stuttgart, Germany
Abstract
For the mountedprinted circuit board inspection, the inspection system is required to detect the 3-D position of the components. To detect the 3-D positions of components,a 3-D vision sensor with multiple CCD cameras has been introduced. The system executes the stereo image processing to measure the 3-D position of he objects. For the electric components, the expected position on he PCB boards can be defined. So, the method of stereo image processing is simplified. Only preparing a measuremen line on every component is enough to detect its position. To perform the stereo image processing on the line, Dynamic Programming can be applied to perform the stereo matching between the locally deformed two images. Introducing the DP method to the stereo matching,the experimental system has been proved its precise 3-D position detection ability.
© (2002) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Seiji Hata, Daisuke Shima, and Kan'ichi Kaida "Three-dimensional vision sensor with multiple CCD cameras", Proc. SPIE 4902, Optomechatronic Systems III, (18 October 2002); https://doi.org/10.1117/12.468381
Lens.org Logo
CITATIONS
Cited by 8 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Cameras

3D image processing

3D vision

Inspection

Image processing

Sensors

Stereo vision systems

RELATED CONTENT

Research progress of depth detection in vision measurement a...
Proceedings of SPIE (September 26 2013)
The progress of sub-pixel imaging methods
Proceedings of SPIE (February 21 2014)
Sensor-based navigation of air duct inspection mobile robots
Proceedings of SPIE (February 12 2001)
3D Measurement From 10 CM To 10 M
Proceedings of SPIE (February 15 1989)
Agile automated vision
Proceedings of SPIE (November 23 1994)

Back to Top