Sacrificial layer for the fabrication of electroformed cantilevered LIGA microparts

Alfredo M. Morales; Georg Aigeldinger; Michelle A. Bankert; Linda A. Domeier; John T. Hachman; Cheryl Hauck; Patrick N. Keifer; Karen L. Krafcik; Dorrance E. McLean; Peter C. Yang

doi:10.1117/12.472751

15 January 2003 Sacrificial layer for the fabrication of electroformed cantilevered LIGA microparts

Alfredo M. Morales, Georg Aigeldinger, Michelle A. Bankert, Linda A. Domeier, John T. Hachman, Cheryl Hauck, Patrick N. Keifer, Karen L. Krafcik, Dorrance E. McLean, Peter C. Yang

Author Affiliations +

Proceedings Volume 4979, Micromachining and Microfabrication Process Technology VIII; (2003) https://doi.org/10.1117/12.472751
Event: Micromachining and Microfabrication, 2003, San Jose, CA, United States

Abstract

The use of silver filled PMMA as a sacrificial layer for the fabrication of multilevel LIGA microparts is presented. In this technique, a bottom level of standard electroformed LIGA parts is first produced on a metallized substrate such as a silicon wafer. A methyl methacrylate formulation mixed with silver particles is then cast and polymerized around the bottom level of metal parts to produce a conducting sacrificial layer. A second level of PMMA x-ray resist is adhered to the bottom level of metal parts and conducting PMMA and patterned to form another level of electroformed features. This presentation will discuss some the requirements for the successful fabrication of multilevel, cantilevered LIGA microparts. It will be shown that by using a silver filled PMMA, a sacrificial layer can be quickly applied around LIGA components; cantilevered microparts can be electroformed; and the final parts can be quickly released by dissolving the sacrificial layer in acetone.

Citation Download Citation

Alfredo M. Morales, Georg Aigeldinger, Michelle A. Bankert, Linda A. Domeier, John T. Hachman, Cheryl Hauck, Patrick N. Keifer, Karen L. Krafcik, Dorrance E. McLean, and Peter C. Yang "Sacrificial layer for the fabrication of electroformed cantilevered LIGA microparts", Proc. SPIE 4979, Micromachining and Microfabrication Process Technology VIII, (15 January 2003); https://doi.org/10.1117/12.472751

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