Failure prediction across process window for robust OPC

Shumay D. Shang; Yuri Granik; Nicolas B. Cobb; Wilhelm Maurer; Yuping Cui; Lars W. Liebmann; James M. Oberschmidt; Rama Nand Singh; Ben R. Vampatella

doi:10.1117/12.485478

26 June 2003 Failure prediction across process window for robust OPC

Shumay D. Shang, Yuri Granik, Nicolas B. Cobb, Wilhelm Maurer, Yuping Cui, Lars W. Liebmann, James M. Oberschmidt, Rama Nand Singh, Ben R. Vampatella

Author Affiliations +

Proceedings Volume 5040, Optical Microlithography XVI; (2003) https://doi.org/10.1117/12.485478
Event: Microlithography 2003, 2003, Santa Clara, California, United States

Abstract

In conventional Optical and Process Correction (OPC), models are calibrated with the CD measurement from the “good” printable patterns. Predictions of process window loss are based on extrapolation from the “good” region into the failure region. The extrapolation is always a less accurate process than interpolation. In this paper, we utilize the experimental pass/fail data to build models that accurately identify and predict printing failures. We developed a methodology and a formal apparatus for failure modeling. It is found that two or more aerial image shape parameters are required to describe all failure mechanisms for a sub-100nm process. This empirical failure model is currently applied to Optical Rule Checking (ORC) of the post-OPC layout. It also can be used to constrain layout corrections in the future.

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Shumay D. Shang, Yuri Granik, Nicolas B. Cobb, Wilhelm Maurer, Yuping Cui, Lars W. Liebmann, James M. Oberschmidt, Rama Nand Singh, and Ben R. Vampatella "Failure prediction across process window for robust OPC", Proc. SPIE 5040, Optical Microlithography XVI, (26 June 2003); https://doi.org/10.1117/12.485478

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