Paper
20 May 2004 Projection maskless lithography
Christoph Brandstatter, Hans Loeschner, Gerhard Stengl, Gertraud Lammer, Herbert Buschbeck, Elmar Platzgummer, Hans-Joachim Doring, Thomas Elster, Olaf Fortagne
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Abstract
Recent studies have shown the feasibility of Projection Mask-Less Lithography (PML2) for small and medium volume device production (2-5 WPH) for the 45nm technology node. This PML2 tool concept comprises a combined electrostatic-magnetic electron optical column with 200x de-magnification factor. Instead of a mask there is a programmable aperture plate enabling dynamic beam structuring. Wafer exposure is done stripe-by-stripe with a scanning 300mm wafer stage. Detailed calculations of the PML2 optical column (2-step demagnification) including Monte-Carlo simulations of Coulomb interactions are presented. The extendibility of PML2 technology for the 32nm node will be discussed.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christoph Brandstatter, Hans Loeschner, Gerhard Stengl, Gertraud Lammer, Herbert Buschbeck, Elmar Platzgummer, Hans-Joachim Doring, Thomas Elster, and Olaf Fortagne "Projection maskless lithography", Proc. SPIE 5374, Emerging Lithographic Technologies VIII, (20 May 2004); https://doi.org/10.1117/12.535412
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Cited by 5 scholarly publications.
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KEYWORDS
Semiconducting wafers

Wafer-level optics

Lithography

Electrodes

Electron beams

Photomasks

Magnetism

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