Paper
21 July 2004 Barkhausen noise and eddy current microscopy: a new scanning probe technique for microscale characterization of materials
Klaus Szielasko, Sergey Lugin, Melanie Kopp, Iris Alpeter
Author Affiliations +
Abstract
The need for an accelerated development of new materials and surfaces raises expectations in lateral homogeneity and quantitative exactness of the characteristic material properties. The interest is focused on microstructure characterization, detection of micro-imperfections and evaluation of the local distribution of residual stresses, mechanical hardness and coating thickness. These requirements meet with the development of high-resolution NDT methods such as Barkhausen Noise and Eddy Current MIcroscopy (BEMI) at IZFP. BEMI enables locally high-resolved non-destructive materials testing by means of Barkhausen noise and eddy current analysis: The sample is scanned with a miniaturized inductive probe which serves as Barkhausen noise pick-up and eddy current inductive sensor. Characteristic quantities are derived from the measured data and mapped as 2-D or 3-D images allowing the recognition of defects as small as 5 μm. The device is controlled by a modular measuring system which is split into modules for positioning, data acquisition and evaluation. Two additional software modules enable contact-less, quantitative testing of sensitive surfaces. This way, thin coatings can be characterized regarding their microstructure, thickness, internal stresses and heat-treatment condition. The efficiency of this device was demonstrated on many materials as solids stacks of several thin films. The BEMI testing device achieves an accuracy of 10 nm for the thickness of thin films on a variety of substrates.
© (2004) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Klaus Szielasko, Sergey Lugin, Melanie Kopp, and Iris Alpeter "Barkhausen noise and eddy current microscopy: a new scanning probe technique for microscale characterization of materials", Proc. SPIE 5392, Testing, Reliability, and Application of Micro- and Nano-Material Systems II, (21 July 2004); https://doi.org/10.1117/12.540463
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Cited by 5 scholarly publications.
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KEYWORDS
Coating

Microscopy

Calibration

Nondestructive evaluation

Sensors

Thin films

Copper

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