Paper
17 May 2005 Broadband RF process-state sensor for fault detection and classification
Author Affiliations +
Abstract
In this paper, we present a novel broadband radio frequency (RF) sensor technology, which can be used for plasma process control, including Fault Detection and Classification (FDC). Plasma is a non-linear complex electrical load, therefore generates harmonics of the driving frequency in the electrical circuit. Plasma etch processes have dependencies on chamber pressure, delivered power, wall and substrate temperatures, gas phase and surface chemistry, chamber geometry and particles, and many other second order contributions. Any changes, which affect the plasma complex impedance, will be reflected in the Fourier spectrum of the driving RF power source. We have found that high-resolution broadband sensing, up to 1GHz or more than 50 harmonics (for a fundamental frequency of 13.56MHz), greatly increases the effectiveness of RF sensing for process-state monitoring. This paper describes the measurement sampling technique; the broadband RF sensor and presents data from commercial plasma etch tool monitoring.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Francisco Martinez, Paul Scullin, and John Scanlan "Broadband RF process-state sensor for fault detection and classification", Proc. SPIE 5755, Data Analysis and Modeling for Process Control II, (17 May 2005); https://doi.org/10.1117/12.606991
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CITATIONS
Cited by 2 scholarly publications and 1 patent.
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KEYWORDS
Sensors

Plasma

Plasma etching

Etching

Signal to noise ratio

Signal processing

Digital signal processing

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