Numerical study on cold transfer characteristics of the space in a semiconductor refrigeration device

Hui Zhang; Jun Wang; Kuang-Chao Fan

doi:10.1117/12.716369

25 October 2006 Numerical study on cold transfer characteristics of the space in a semiconductor refrigeration device

Hui Zhang, Jun Wang, Kuang-Chao Fan

Proceedings Volume 6280, Third International Symposium on Precision Mechanical Measurements; 62803Y (2006) https://doi.org/10.1117/12.716369
Event: Third International Symposium on Precision Mechanical Measurements, 2006, Urumqi, China

Abstract

This paper presented the variation law of temperature in three-dimensional space, which is cooled by the refrigeration provided by the cold side of a semiconductor. It's tested under the conditions of the natural and forced convection in a semiconductor refrigeration device under steady working conditions. The mathematical model of the temperature field of the semiconductor refrigeration device is described, and a numerical study on the temperature profile in a semiconductor refrigeration device was carried out using this model. Numerical simulation is applied to the present thermostated container. Then the space tempo direction in the case of the gas flows, distribution of pressure in each point, the data of three-dimensional temperature field, etc. are gained. The problems in present thermostated containers are discussed, the factor influencing current air organization and temperature field are analyzed. The experimental results show that forced convection is of benefit to the cold transfer and to the rise of refrigeration rate.

Citation Download Citation

Hui Zhang, Jun Wang, and Kuang-Chao Fan "Numerical study on cold transfer characteristics of the space in a semiconductor refrigeration device", Proc. SPIE 6280, Third International Symposium on Precision Mechanical Measurements, 62803Y (25 October 2006); https://doi.org/10.1117/12.716369

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