Tomographic studies of 3D refractive index and birefringence distribution in M-O elements replicated by hot embossing technology

Malgorzata Kujawinska; Rafal Krajewski; Nitish Kumar; Juergen Mohr; Hugo Thienpont

doi:10.1117/12.798318

11 August 2008 Tomographic studies of 3D refractive index and birefringence distribution in M-O elements replicated by hot embossing technology

Malgorzata Kujawinska, Rafal Krajewski, Nitish Kumar, Juergen Mohr, Hugo Thienpont

Author Affiliations +

Proceedings Volume 7064, Interferometry XIV: Applications; 70640H (2008) https://doi.org/10.1117/12.798318
Event: Optical Engineering + Applications, 2008, San Diego, California, United States

Abstract

The technology path to produce low cost microinterferometric heads in plastic and the optical methods for quality investigations of these elements are presented. Specifically the interferometric and photoelastic tomography methods, applied for the 3D studies of refractive index (n) and birefringence (B) in photonics components replicated by means of hot embossing (HE) technology, are investigated. The enhanced automated measurement and data analysis procedures are described and the experimental results obtained for micro-objects working in transmission are given. Also the methodology to combine the tomographic data for full characterization of internal structure of 3D photonics elements is provided. The samples under test are massive waveguide microinterferometerers in the form of cuboids produced by hot embossing process characterized by a variety of parameters. The systematic tomographic studies of 3D distribution of n and B provided important information for extending knowledge about the process and optimization hot embossing technology. The tomographic measurements are supported by measurements of top and side walls profile and roughness.

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Malgorzata Kujawinska, Rafal Krajewski, Nitish Kumar, Juergen Mohr, and Hugo Thienpont "Tomographic studies of 3D refractive index and birefringence distribution in M-O elements replicated by hot embossing technology", Proc. SPIE 7064, Interferometry XIV: Applications, 70640H (11 August 2008); https://doi.org/10.1117/12.798318

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