Thin film SixGe1-xOy infrared sensitive material was grown by RF magnetron sputtering, by depositing Si and Ge thin
film simultaneously from two deposition targets in an oxygen (O) and argon environment at room temperature and at
400°C. Film composition was varied by adjusting RF power applied to the silicon target and by varying the oxygen
flow of the gas mixture in the deposition chamber. The atomic compositions of Si, Ge, and O in the deposited thin film
were determined and analyzed using energy dispersive X-ray spectroscopy (EDS). The influence of changing Ge and
Si and O compositions on temperature coefficient of resistance (TCR), and resistivity were studied. Different
fabrication scenarios have been used to vary the Ge, Si and O concentrations. The highest achieved TCRs and the
corresponding resistivities at room temperature were -4.86 %/K and -6.43 %/K, and 2.45×102 Ω cm and 3.34×102 Ω
cm using Si0.195Ge0.706O0.099and Si0.127Ge0.835O0.038 for films deposited at room temperature and at 400 oC, respectively.
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