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The Wide-field Infrared Survey Explorer (WISE) is a medium class NASA Explorer mission designed to map the
entire sky in 4 mid-infrared bands, with band centers at 3.4, 4.6, 12 & 22 μm. The sensitivity requirements are
120, 160, 850 & 4000 μJy in these bands. The angular resolution should be 6" FWHMor better except at 22 μm
where diffraction in the 40 cm diameter aperture degrades the resolution to 12" FWHM. WISE takes images
simultaneously in all 4 bands in a 47' FOV using 10242 pixel arrays and 2.75" pixels. WISE will be launched
into a 500 km altitude 97° inclination Sun-synchronous orbit at the terminator. Launch is currently scheduled
for 6 AM in late 2009. WISE scans a circle perpendicular to the Earth-Sun line which leads to an all-sky survey
in 6 months.
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Room Temperature Detector Materials: Joint Session with Conference 7419B
Carbon nanotube (CNT) has been found to be one of the promising materials for efficient detection and used in different
nanoelectronic devices due to its unique electrical properties. Recently, the applications of nanostructural material to
infrared (IR) sensors are considered. Our group has developed non cryogenic cool and multiple spectrums optical
sensors using single CNT and demonstrated the good sensitivity of CNT to the infrared light in different ranges. In this
paper, design, fabrication and experimental result of the CNT-based optical sensor were described. The results indicated
the band gap of CNTs can be tuned by electrical breakdown process, resulting multiple spectrum sensors can be
developed by controlling the band gap of CNTs. Moreover, the
CNT-based optical sensor detected the near-IR (NIR)
signal and middle-wave IR (MWIR) signal in room temperature environment, the temperature dependency of the sensors
has been studied.
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Pyroelectric infrared Lithium tantalite [(LiTaO3), LT] ceramic particles and silver nanoparticles have
been incorporated into a polyvinylidene fluoride-trifluoroethylene [P(VDF-TrFE) 70/30 mol%]
copolymer matrix to form composite films. The films were prepared using solvent casting method.
Electrical properties such as the dielectric constant, dielectric loss, and pyroelectric coefficient have been
measured as a function of temperature. In addition, materials' figures-of-merit have also been calculated
to assess their use in infrared detectors. The results show that the fabricated silver nanoparticles
incorporated lithium tantalite: polyvinylidene
fluoride-trifluoroethylene composite films may have a good
potential for uncooled infrared sensor applications.
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In this paper, we report that integrated pyroelectric infrared(IR) sensor array using surface micromachine
technique with nMOS/nJFET devices on epitaxial γ-Al2O3/Si substrates has been successfully fabricated. Orientation
and crystallinity control of pyroelectric and ferroelectric films are important to archive high sensitivity pyroelectric IR
detector. We propose epitaxial γ-Al2O3 thin films as buffer layer on Si substrates to control them. Each pixel of
fabricated IR sensor array has a thermally isolated Au/PZT(001)/Pt(001)/γ-Al2O3 stacked membrane detector, a low
noise nJFET source follower and a switching nMOSFET. A voltage sensitivity of a fabricated detector is increased by
forming thermal isolated structure. The fabricated sensor operated under a chopping frequency of 100 Hz. The RV,
NEP and D* at 30 Hz are 1703 V/W, 7.22 × 10-11 WHz-1/2 and 1.38 × 108 cmHz1/2W-1, respectively. This sensor will
have potential for Si integrated pyroelectric IR imager.
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A new pyroelectric polar nanocomposite thin film is presented. A dense array of aluminium oxide cylindrical nanopores
is used as a template to grow pyroelectric nano-crystals of TriGlycine Sulfate (TGS). The crystals are grown inside
nanopores having an average diameter of 14±4nm and a length of 0.5 micron. The crystals are grown with a preferred
crystallographic orientation having their polar axis [010] aligned in vertical to the film plane. The pyroelectric response
at different temperatures is measured using the dynamic method. The dielectric characterization reveals resistivity of
about 1E-9 ohm-m, dielectric loss (tan(δ)) of about 0.03, and relative dielectric permittivity of about 10 at room
temperature which increases to a maximum value at the ferroelectric-paraelectric phase transition. The pyroelectric
coefficient of the film is about 3.5 μC/m2K and the pyroelectric voltage figure of merit is about 40 kVm-1K -1.
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The James Webb Space Telescope, an infrared-optimized space telescope being developed by NASA for launch in 2014,
will utilize cutting-edge detector technology in its investigation of fundamental questions in astrophysics. JWST's near
infrared spectrograph, NIRSpec utilizes two 2048 × 2048 HdCdTe arrays with Sidecar ASIC readout electronics
developed by Teledyne to provide spectral coverage from 0.6 microns to 5 microns. We present recent test and
calibration results for the "pathfinder NIRSpec detector subsystem" as well as data processing routines for noise
reduction and cosmic ray rejection.
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A long wave infrared (LWIR) division of amplitude imaging Stokes polarimeter is presented. For the first time, to our
knowledge, application of microbolometer focal plane array (FPA) technology to polarimetry is demonstrated. The
sensor utilizes a wire-grid beamsplitter with imaging systems positioned at each output to analyze two orthogonal linear
polarization states simultaneously. Combined with a form birefringent wave plate, the system is capable of snapshot
imaging polarimetry in any one Stokes parameter (S1, S2 or S3). Radiometric and polarimetric calibration procedures for
the instrument are provided and data from the instrument are presented, demonstrating the ability to measure intensity
variations corresponding to polarized emission in natural environments. As such, emission polarimetry can be exploited
at significantly reduced cost, sensor size and power consumption over instruments based on more costly
Mercury-Cadmium Telluride (MCT) FPA's.
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Channeled spectropolarimetry, first developed by K. Oka, is capable of measuring all the Stokes parameters from a
single modulated spectrum. We present a theoretical means for improving the spectral resolution of channeled
spectropolarimetry by at least a factor of four. Especially valuable in the infrared due to atmospheric absorption features,
this method simultaneously provides for the correction of aliasing artifacts from the channels used for the determination
of the Stokes parameters. The technique is experimentally demonstrated using a Fourier transform infrared spectrometer
and two multiple-order Yttrium Vanadate (YVO4) retarders. This approach is implemented with consideration of crystal
dichroism effects, and reconstructions are compared with conventional channeled spectropolarimetric reconstructions
from the same system. Additional results, produced by using Cadmium Sulfide (CdS) retarders, provide demonstration
of the technique across the infrared.
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We present the design, fabrication, characterization of spatially variable infrared filter and a demonstration
of the filter as a simple infrared spectrometer. A varying photonic band gap filter which consists of thermally
evaporated, high refractive index contrast amorphous chalcogenide glass multilayers, makes the structure suitable
to be used as spectrometer. Due to graded thickness structure, the filter exhibits a position dependent stop band
and a cavity mode ranging from 2 to 8 μm wavelengths. It is demonstrated that the filter can be used to detect
absorption peaks of common gases in the cavity mode range of the filter.
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Unipolar barriers can block one carrier type but allow the un-impeded flow of the other. They can be used to implement the barrier
infra-red detector (BIRD) design for increasing the collection efficiency of photo-generated carriers, and reducing dark current generation without impeding photocurrent flow. In particular, the InAs/GaSb/AlSb material system, which can be epitaxially grown on GaSb or InAs substrates, is well suited for implementing BIRD structures, as there is considerable flexibility in forming a variety of alloys and superlattices, and tailoring band offsets. We describe our efforts to achieve high-performance long wavelength InAs/GaSb superlattice infrared photodetectors based on the BIRD architecture. Specifically, we report a 10 μm cutoff device based on a complementary barrier infrared detector (CBIRD) design. The detector, without anti-reflection coating, exhibits a responsivity of 1.5 A/W and a dark current density of 1×10-5 A/cm2 at 77K under 0.2 V bias. It reaches 300 K background limited infrared photodetection (BLIP) operation at 101 K, with a black-body BLIP D* value of 2.6×1010 cm-Hz1/2/W for 2π field of view under 0.2 V bias.
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A new feedback readout circuit of microbolometers for sensing radiant power is proposed in this paper. Due to excellent
thermal characteristics of microstructure on infrared application recently, the readout circuits of the microsensors would
not concern the responsivity only, but should also take offset voltage cancellation, digitalization, and signal-to-noise ratio
under considerations. Although Wheatstone bridge readout circuit has been widely used in resistive thermal sensor
readout for several decades, its nonlinear output voltage acting as the offset voltage still perplex us, as well as its
digitalization and signal-to-noise ratio could be unsatisfied for microbolometer applications. Hence, we present the
feedback readout which could optimize the key factors simultaneously and increase the responsivity without any layout
modification of the bridge structure on Infrared Focal Plane Array (IRFPA) microbolometer chip. The results revealed
that the balanced parameter, frequency, equal to 0.5 would be the best condition for these requirements instead of the
balanced parameter equal to unity by intuition traditionally. Compared to traditional Wheatstone bridge readout circuit,
the feedback readout circuit would improve the responsivity of 2.86 times, immunize the offset voltage exactly, obtain a
very large OVRR, and reduce the noise of the readout circuit of 5.6 dB. These significantly important results will
improve significantly the performance of the readout circuit, and speed up the commercialization of infrared focal plane
array of microbolometers.
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Unique Applications and Materials: Joint Session with Conference 7419B
An overview of the properties of the absorption coefficient of mercury cadmium telluride
that may make this material useful for intrinsic hyperspectral detection is presented. A review of
recent work on modeling the absorption coefficient is provided, and new directions for achieving an
analytical representation with higher fidelity are suggested.
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Poster Session for Infrared Detectors and Focal Plane Arrays IX
It is suggested to use a precision thermal receiver built as a trap detector and consisting of "basic" thermal receivers to
create a standard comparison for optic emission. A metering problem is then stated for a stand-alone "basic" receiver,
and principal relations are defined to allow calculation of its stationary temperature mode, while taking into
consideration radiant and convective heat losses.
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Mercury Cadmium Telluride (HgCdTe) is the material of choice for the majority of high performance infrared focal
plane array (IRFPA) systems fielded in the Army with state-of-the-art HgCdTe growth using a bulk Cadmium Zinc
Telluride (CdZnTe) substrate. However, as the push for larger array sizes continues, it has been recognized that an
alternative substrate technology will be required for HgCdTe IRFPAs. A major effort has been placed in developing
CdTe/Si as such a substrate. Although successful for short-wavelength (SWIR) and mid-wavelength (MWIR) focal
plane arrays, current HgCdTe/Si material quality is insufficient for long-wavelength (LWIR) arrays due to the high
density of dislocations present in the material. In this paper, we will discuss several processes being developed at the
U.S. Army Research Laboratory (ARL) to overcome this issue. Effort has been placed on both composite substrate
development and improvement, and on HgCdTe/Si post-growth processes. Recently, we have demonstrated HgCdTe/Si
material with dislocation density measuring 1 × 106 cm-2. This is a five times reduction in the baseline material
dislocation density currently used in the fabrication of devices.
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The observation of astrophysical objects in the mid-infrared requires Blocked Impurity Band (BIB) detectors
based on n-doped Silicon. It is desirable to observe faint astronomical objects with such a detector, which can
be achieved with a high Signal to Noise ratio. One possibility is an implemented Depleted P-channel Field Effect
Transistor (DEPFET) Active Pixel Sensor (APS)1 on the BIB detector in order to be free of interconnection
stray capacitance. A noise of 2 e- ENC and a current amplification of 300 pA per e- can be obtained at room temperature.
These detectors operate at a temperature range from 6 K to 12 K. The DEPFET is operated under these
conditions to investigate the functional principle of the detector. We show results of characteristic and dynamic
measurements of the single pixel DEPFET at low temperature. We irradiate the DEPFET single pixel with
x-rays originating from the nuclear decay of Fe55 and take a spectrum of the Kα- and Kβ-line. Uncomplete clear
is identified with freeze-out of the signal charge into ionized shallow donor states in the heavily doped internal
Gate of the DEPFET due to low thermal energy. We found a solution to emit the localized signal charges into
the conduction band in order to ensure the transport from the internal Gate to the Clear contact.
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We present the design and development of a negative feedback devices using the internal discrete amplifier
approach used for the development of a single photon avalanche photodetector in the near infrared
wavelength region. This new family of photodetectors with negative feedback, requiring no quenching
mechanism using Internal Discrete Amplification (IDA) mechanism for the realization of very high gain
and low excess noise factor in the visible and near infrared spectral regions, operates in the non-gated mode
under a constant bias voltage. The demonstrated device performance far exceeds any available solid state
Photodetectors in the near infrared wavelength range. The measured devices have Gain > 2×105, Excess
noise factor < 1.05, Rise time < 350ps, Fall time < 500ps, Dark current < 2×106 cps at room temperature,
and Operating Voltage < 60V. These devices are ideal for researchers in the field of Ladar/Lidar, free space
optical communication, 3D imaging, industrial and scientific instrumentation, night vision, quantum
cryptography, and other military, defence and aerospace applications.
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This paper presents the design of quarter-wave retarders for the Dense Wave Division
Multiplexing using parallel mirrors coated with a single layer. The output light from the device is
parallel to the input light and displaced by a distance d. The quarter-wave retarder total reflection
is in the range of 83%. Error analysis on the design is also presented. The error analysis shows
how changes on the angle of incident light and the thin film thicknesses affect the design of the
retarders.
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A novel detector, incorporating e2v's L3 CCD
(L3VisionTM) [1] technology for use in LIDAR (Light
Detection And Ranging) applications has been
designed, manufactured and characterised. The most
critical performance aspect was the requirement to
collect charge from a 120μm square detection area for a
667ns temporal sampling window, with low crosstalk
between successive samples, followed by signal readout
with sub-electron effective noise. Additional
requirements included low dark signal, high quantum
efficiency at the 355nm laser wavelength and the ability
to handle bright laser echoes, without corruption of the
much fainter useful signals.
The detector architecture used high speed charge
binning to combine signal from each sampling window
into a single charge packet. This was then passed
through a multiplication register (EMCCD) operating
with a typical gain of 100X to a conventional charge
detection circuit. The detector achieved a typical
quantum efficiency of 80% and a total noise in darkness
of < 0.5 electrons rms. Development of the detector was
supported by ESA.
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In this paper, we report the latest results on our development of delta-doped, thinned, back-illuminated CMOS imaging
arrays. As with charge-coupled devices, thinning and back-illumination are essential to the development of high
performance CMOS imaging arrays. Problems with back surface passivation have emerged as critical to the prospects
for incorporating CMOS imaging arrays into high performance scientific instruments, just as they did for CCDs over
twenty years ago. In the early 1990's, JPL developed delta-doped CCDs, in which low temperature molecular beam
epitaxy was used to form an ideal passivation layer on the silicon back surface. Comprising only a few nanometers of
highly-doped epitaxial silicon, delta-doping achieves the stability and uniformity that are essential for high performance
imaging and spectroscopy. Delta-doped CCDs were shown to have high, stable, and uniform quantum efficiency across
the entire spectral range from the extreme ultraviolet through the near infrared. JPL has recently bump-bonded thinned,
delta-doped CMOS imaging arrays to a CMOS readout, and demonstrated imaging. Delta-doped CMOS devices exhibit
the high quantum efficiency that has become the standard for scientific-grade CCDs. Together with new circuit designs
for low-noise readout currently under development, delta-doping expands the potential scientific applications of CMOS
imaging arrays, and brings within reach important new capabilities, such as fast, high-sensitivity imaging with parallel
readout and real-time signal processing. It remains to demonstrate manufacturability of delta-doped CMOS imaging
arrays. To that end, JPL has acquired a new silicon MBE and ancillary equipment for delta-doping wafers up to 200mm
in diameter, and is now developing processes for high-throughput, high yield delta-doping of fully-processed wafers
with CCD and CMOS imaging devices.
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Room Temperature Detector Materials: Joint Session with Conference 7419A
EO/IR Nanosensors are being developed for a variety of Defense and Commercial Systems
Applications. These include UV, Visible, NIR, MWIR and LWIR Nanotechnology based
Sensors. The conventional SWIR Sensors use InGaAs based IR Focal Plane Array (FPA) that
operate in 1.0-1.8 micron region. Similarly, MWIR Sensors use InSb or HgCdTe based FPA that
is sensitive in 3-5 micron region. More recently, there is effort underway to evaluate low cost
SiGe visible and near infrared band that covers performance up to 1.6 micron.
The use of Nanowires for developing high quality antireflection coatings that allows minimizing
the reflection loss is discussed. We have explored the possibility of using nanostructures grown
by oblique angle deposition technique. A graded-index coating with different index profiles has
been investigated for broadband antireflection properties, particularly with air as the ambient
medium. In this paper, we present, modeling and experimental results for nanostructure
AR coatings for UV, Visible and calculations for NIR sensors and also their utility for
longer wavelength application.
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Unique Applications and Materials: Joint Session with Conference 7419A
High resolution imaging in UV band has a lot of applications in Defense and Commercial systems. The
shortest wavelength is desired for spatial resolution which allows for small pixels and large formats.
UVAPD's have been demonstrated as discrete devices demonstrating gain. The next frontier is to develop UV
APD arrays with high gain to demonstrate high resolution imaging.
We will discuss an analytical model that can predict sensor performance in the UV band using p-i-n or APD
detectors with and without gain and other detector and sensor parameters for a desired UV band of interest.
SNR's can be modeled from illuminated targets at various distances with high resolution under standard
MODTRAN atmospheres in the UV band and the solar blind region using detector arrays with unity gain
and with high gain APD along with continuous or pulsed UV lasers.
The performance can be determined by the signal level which results from the UV laser return energy (laser
power, beam divergence, target reflectance and atmospheric transmittance), the optics f/number, the response
of the detector (collection area, quantum efficiency, fill factor and gain), and the total noise which will be the
sum of the dark current noise, the scene noise, and the amplifier noise. We also discuss trades as a function
of detector response, dark current noise and the 1/f noise. We also present various approaches and device
designs that are being evaluated for developing APD's in wide band gap semiconductors. The paper also
discusses current state of the art in UV APD and the future directions for small unit cell size and gain in the
APD's.
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Poster Session for Infrared Detector Devices and Photoelectronic Imagers IV
Range-resolved reflective tomography using short pulselength lasers has been shown to be an image reconstruction
method which can be used to recover image information about an object with a non-imaging laser radar (ladar) system.
The resulting time-dependent return signal (Project) is collected by a non-imaging optical system, which provides a onedimensional
signal as a function of range.
This paper presents a short pulselength direct-detect laser reflective tomography imaging ladar, and gives the image
reconstruction results. In order to efficiently improve and modify the algorithms developed for reflective tomography,
we develop a new imaging reconstruction algorithm.
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The filtered back-projection algorithm is referenced and used for reflective tomography laser radar imaging
reconstruction because of its simplicity and computational efficiency. Due to the divergence angle of the laser beam,
wave front becomes fanned surface. However, direct fan-beam filtered back-projection imaging algorithm with the
fan-beam reflective projection data exits huge computational complexity and long time consuming. To solve this
question, the double broken lines filtered back-projection algorithm is introduced to implement the image reconstructions.
Fan-beam reflective data is filtered and back-projected to the double broken lines with corresponding angles and
distances. Images reconstructed by fan-beam filtered back-projection and double broken lines filtered back-projection are
compared by computer simulation based on reflective projection data. The simulation results show that double broken
lines filtered back-projection algorithm is effective in solving the computational complexity problem in image
reconstruction without compromising the image resolution, also with the increasing distance between the detector and
the target, the images reconstructed by the double broken lines filtered back-projection are increasing closely to the
reference image.
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Almost two years after the investors in Sarcon Microsystems pulled the plug, the micro-cantilever array based uncooled
IR detector technology is again attracting more and more attention because of its low cost and high
credibility. An uncooled thermal detector array with low NETD is designed and fabricated using MEMS
bimaterial microcantilever structures that bend in response to thermal change. The IR images of objects obtained
by these FPAs are readout by an optical method. For the IR images, one of the most problems of FPN is
complicated by the fact that the response of each FPA detector changes due to a variety of factors, causing the
nonuniformity pattern to slowly drift in time. Thus, it is required to remove the nonuniformity. A scene-based
nonuniformity correction algorithm was discussed in this paper, against to the traditional calibration-based and
other scene-based techniques, which has the better correct performance; better MSE compared with traditional
methods can be obtained. Great compute and analysis have been realized by using the discussed algorithm to the
simulated data and real infrared scene data respectively. The experimental results demonstrate, the corrected image
by this algorithm not only yields highest Peak Signal-to-Noise Ratio values (PSNR), but also achieves best visual
quality.
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In this work, a photodiode for the visible spectral range, which will be integrated monolithically with CMOS circuits, is
presented. Such Optoelectronic Integrated Circuit (OEIC) with high sensitivity in the 400-900 nm spectral range is
utilized to realize electronic processing from the light beam position that hit a specific area of the photodetector. The
output signals with voltages of 0V and 3 V can be implemented with a controller circuit. By the Using of He-Ne Laser
at 633 nm as incident light, the responsivity of the Position Sense Photodetector (PSPD) was 0.35 A/W and the rise and
fall time of less than 30 ns were achieved. These parameters were necessaries to achieve the photodiode integration in an
industrial 0.5 μm CMOS process, only additional mask was needed in order to block out the threshold voltage
implantation in the photo-active region. Therefore both designs of photodiode and the electronic processing circuit
separately, are shown here, all design will be integrated monolithically in the same Silicon chip.
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We propose an Eye Tracker/Display system, based on a novel, dual function device termed ETD, which allows sharing
the optical paths of the Eye tracker and the display and on-chip processing. The proposed ETD design is based on a
CMOS chip combining a Liquid-Crystal-on-Silicon (LCoS) micro-display technology with near infrared (NIR) Active
Pixel Sensor imager. The ET operation allows capturing the Near IR (NIR) light, back-reflected from the eye's retina.
The retinal image is then used for the detection of the current direction of eye's gaze.
The design of the eye tracking imager is based on the "deep p-well" pixel technology, providing low crosstalk while
shielding the active pixel circuitry, which serves the imaging and the display drivers, from the photo charges generated
in the substrate. The use of the ETD in the HMD Design enables a very compact design suitable for Smart Goggle
applications. A preliminary optical, electronic and digital design of the goggle and its associated ETD chip and digital
control, are presented.
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