Paper
14 May 2010 CSI Helsinki: comparing three-dimensional imaging of diagonal cutter toolmarks using confocal microscopy and SWLI
I. Kassamakov, C. Barbeau, S. Lehto, P. Ahvenainen, T. Reinikainen, E. Hæggström
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Abstract
Cutting tools leave characteristic marks that can connect a set of toolmarks to an individual tool. When the depth resolution of an optical microscope is insufficient, more advanced three-dimensional (3D) imaging methods such as Scanning White Light Interferometry (SWLI) and confocal microscopy are required. We cut ten copper wires (2.1±0.1 mm diameter) maintaining a predefined blade orientation and position using diagonal cutting pliers. Images of the sample surfaces were created using equipment based on optical microscopy, SWLI and confocal microscopy. SWLI and confocal microscopy set-ups can produce consistent high-resolution 3D images that are relevant for forensic toolmark comparison.
© (2010) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
I. Kassamakov, C. Barbeau, S. Lehto, P. Ahvenainen, T. Reinikainen, and E. Hæggström "CSI Helsinki: comparing three-dimensional imaging of diagonal cutter toolmarks using confocal microscopy and SWLI", Proc. SPIE 7690, Three-Dimensional Imaging, Visualization, and Display 2010 and Display Technologies and Applications for Defense, Security, and Avionics IV, 76900Y (14 May 2010); https://doi.org/10.1117/12.850046
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Cited by 1 scholarly publication.
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KEYWORDS
3D image processing

Confocal microscopy

Microscopes

Forensic science

Curium

Stereoscopy

Optical interferometry

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