Scatterometric analysis of chatter marks occurring in industrial grinding processes

J. Böhm; A. Vernes; M. Jech; M. Vellekoop

doi:10.1117/12.854419

14 May 2010 Scatterometric analysis of chatter marks occurring in industrial grinding processes

J. Böhm, A. Vernes, M. Jech, M. Vellekoop

Proceedings Volume 7718, Optical Micro- and Nanometrology III; 77181E (2010) https://doi.org/10.1117/12.854419
Event: SPIE Photonics Europe, 2010, Brussels, Belgium

Abstract

Grinding processes often underlie chattering which results in a wavy surface of the ground metal sheet. In this work it will be shown that the angle resolved light scattering method is not only suitable to monitor industrial grinding processes, in both waviness and roughness modes, but also enables the determination of the waviness of a ground surface. Furthermore it is demonstrated that the roughness, e.g. the average roughness R_a and roughness depth R_z, of a ground surface directly depends on the grinding pressure. The light scattering value A_q correlates with the roughness values obtained with a stylus probe system. In this way it is proven that the light scattering system unambiguously determines chatter marks and the roughness of a metal sheet during a grinding process.

Citation Download Citation

J. Böhm, A. Vernes, M. Jech, and M. Vellekoop "Scatterometric analysis of chatter marks occurring in industrial grinding processes", Proc. SPIE 7718, Optical Micro- and Nanometrology III, 77181E (14 May 2010); https://doi.org/10.1117/12.854419

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KEYWORDS

Light scattering

Confocal microscopy

Microscopes

Metals

Radium

Scattering

Optical testing

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