PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
In this paper we present the integration of an InP-based photodetector with silicon-on-insulator (SOI) waveguides using
thermocompression bonding. A BCB prism integrated on top of the light-sensitive area of a planar detector (PD) chip
deflects the light from a 4 μm thick SOI waveguide upward into the flip-chip bonded PD. A trench is etched in front of
the SOI waveguide to accommodate prisms with apexes up to 7 μm. Using thermocompression bonding between thin
gold pads (~500 nm thickness) deposited on both, SOI and photodetector chips an excellent vertical alignment accuracy
of ±100 nm can be achieved, limited only by etching and Au-deposition tolerances. A commercial flip-chip bonder
provides a lateral alignment accuracy also in the sub-micron range. Together with a previously developed process for
integrating lasers and SOA chips using the same technology, fully functional PICs can now be realized on the SOI
platform using thermocompression bonding.
Mikko Harjanne,Markku Kapulainen,Sami Ylinen,Timo Aalto,Jyrki Ollila,Ludwig Mörl, andWolfgang Passenberg
"Hybrid integration of InP photodetectors with SOI waveguides using thermocompression bonding", Proc. SPIE 7719, Silicon Photonics and Photonic Integrated Circuits II, 77190S (17 May 2010); https://doi.org/10.1117/12.854403
ACCESS THE FULL ARTICLE
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
The alert did not successfully save. Please try again later.
Mikko Harjanne, Markku Kapulainen, Sami Ylinen, Timo Aalto, Jyrki Ollila, Ludwig Mörl, Wolfgang Passenberg, "Hybrid integration of InP photodetectors with SOI waveguides using thermocompression bonding," Proc. SPIE 7719, Silicon Photonics and Photonic Integrated Circuits II, 77190S (17 May 2010); https://doi.org/10.1117/12.854403