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Low threshold electron emission from planar AlN/Silicon heterostructures is reported. The surface emitting
ballistic electron structure consisted of an undoped AlN layer grown on Silicon by Molecular Beam Epitaxy, a
Ti/Au Ohmic contact, and a thin Pt Schottky contact fabricated by e-beam deposition. Tunnel-transparent Pt
Schottky contact was deposited on a 1 μm thick Silicon Dioxide (SiO2) layer and covered a 4 x 4 matrix of 50 μm
diameter via produced in the SiO2 layer using photolithography The measurements were performed in vacuum (~10-8 Torr) using a metal grid separated from the structure by a 60 micron thick Kapton® polyimide film having an
opening aligned with the via. Bias voltages in the range of 0-130 V were applied across the Schottky diode, while
currents were recorded across the structure for grid voltages ranging from 0 to 50 V. The field emission nature of the
measured currents was confirmed by plotting the Fowler-Nordheim dependence. Current density of at least 2.5x10-4A/cm2 was achieved for a grid voltage of 50 V and a bias of 130 V. Degradation of the structure performance was
observed at bias voltages exceeding 90 V as a result of Schottky barrier modification under the elevated temperature
and high electric field operation. The solid-state electron emitting structure indicated a threshold field as low as 0.2
V/μm under applied grid voltage of 12 V.
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R. Pillai, D. Starikov, C. Boney, A. Bensaoula, "Hardened planar nitride based cold cathode electron emitter," Proc. SPIE 8262, Gallium Nitride Materials and Devices VII, 82620O (27 February 2012); https://doi.org/10.1117/12.909587