Simulation analysis of directed self-assembly for hole multiplication in guide pattern

M. Muramatsu; T. Nakano; T. Tomita; K. Yamamoto; K. Matsuzaki; T. Kitano

doi:10.1117/12.2045865

28 March 2014 Simulation analysis of directed self-assembly for hole multiplication in guide pattern

M. Muramatsu, T. Nakano, T. Tomita, K. Yamamoto, K. Matsuzaki, T. Kitano

Proceedings Volume 9049, Alternative Lithographic Technologies VI; 904921 (2014) https://doi.org/10.1117/12.2045865
Event: SPIE Advanced Lithography, 2014, San Jose, California, United States

Abstract

In this report, morphology of cylinders by block copolymer (BCP) in the corner rounded rectangle guide patterns is analyzed by simulation and compared with experimental results. In the case of the hole-multiplication, selection the guide pattern size and the affinity of wall and under layer is necessary for stable micro structure. To search the good guide conditions, Ohta-Kawasaki (OK) model and dissipative particle dynamics (DPD) are used. OK model is well known as low cost simulation method, therefore it is expected to use for searching the good guide area roughly from wide range. DPD is one of the strong candidates for DSA simulation, and it is used for prediction of the micro structure. As results, the guide size area which has two PMMA cylinders by 2D OK model seems consistent with experimental results, 3D micro structure by OK model and DPD are comparable, 3D simulations have good agreements with experimental results observed by CD-SEM and STEM. Especially two cylinders connected each other at some point predicted by 3D simulation is observed actually. These simulation approaches will be important to decide the lithography mask design, film stack and pre-treatment conditions for more complex multiplication process, for example, the cut mask application.

Citation Download Citation

M. Muramatsu, T. Nakano, T. Tomita, K. Yamamoto, K. Matsuzaki, and T. Kitano "Simulation analysis of directed self-assembly for hole multiplication in guide pattern", Proc. SPIE 9049, Alternative Lithographic Technologies VI, 904921 (28 March 2014); https://doi.org/10.1117/12.2045865

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