Packaging of hard solder 500W QCW diode laser array

Xiaoning Li; Jingwei Wang; Dong Hou; Zhiqiang Nie; Xingsheng Liu

doi:10.1117/12.2213977

22 April 2016 Packaging of hard solder 500W QCW diode laser array

Xiaoning Li, Jingwei Wang, Dong Hou, Zhiqiang Nie, Xingsheng Liu

Proceedings Volume 9730, Components and Packaging for Laser Systems II; 97300D (2016) https://doi.org/10.1117/12.2213977
Event: SPIE LASE, 2016, San Francisco, California, United States

Abstract

The package structure critically influences the major characteristics of diode laser, such as thermal behavior, output power, wavelength and smile effect. In this work, a novel micro channel cooler (MCC) for stack array laser with good heat dissipation capability and high reliability is presented. Numerical simulations of thermal management with different MCC structure are conducted and analyzed. Based on this new MCC packaging structure, a series of QCW 500W high power laser arrays with hard solder packaging technology has been fabricated. The performances of the laser arrays are characterized. A narrow spectrum of 3.12 nm and an excellent smile value are obtained. The lifetime of the laser array is more than 1.38×10⁹ shots and still ongoing.

Citation Download Citation

Xiaoning Li, Jingwei Wang, Dong Hou, Zhiqiang Nie, and Xingsheng Liu "Packaging of hard solder 500W QCW diode laser array", Proc. SPIE 9730, Components and Packaging for Laser Systems II, 97300D (22 April 2016); https://doi.org/10.1117/12.2213977

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