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13 March 2024 Laser structuring for spectral attenuation of different wavelengths and heat management of components in vacuum
Marco Goebel-Leonhaeuser, Jack Gabzdyl, Christophe Codemard, Adam Rosowski, Christof Siebert
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Proceedings Volume PC12873, Laser-based Micro- and Nanoprocessing XVIII; PC128730A (2024) https://doi.org/10.1117/12.3001659
Event: SPIE LASE, 2024, San Francisco, California, United States
Abstract
TRUMPF Laser & Systemtechnik GmbH is a company offering a wide product portfolio of laser sources, addressing solutions for many industries such as mobility, aerospace, consumer electronics, energy, and data storage. Pulsed short-ns-, ps- and fs- laser sources are interesting for material surface engineering. Surface modification has seen many applications in the recent past, especially for applications such as cleaning or surface preparation prior to welding, gluing, or bonding. In addition, laser surface texturing can create hydrophile or hydrophobic surfaces. However, heat and radiation management of components, in particular where cooling by heat exchange is not possible or less effective, using advanced surface texturing has yet to be explored. For example, vacuum grade microelectronics components might benefit from radiative passive cooling in space environment. In this paper we present results using a ns-laser laser source for surface structuring of metals to enhance attenuation of light and thermal emissivity conductivity. Measurements of emissivity, attenuation will be presented and compared to commercially available surface treatments.
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Marco Goebel-Leonhaeuser, Jack Gabzdyl, Christophe Codemard, Adam Rosowski, and Christof Siebert "Laser structuring for spectral attenuation of different wavelengths and heat management of components in vacuum", Proc. SPIE PC12873, Laser-based Micro- and Nanoprocessing XVIII, PC128730A (13 March 2024); https://doi.org/10.1117/12.3001659
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KEYWORDS
Attenuation
Laser processing
Laser sources
Aluminum
Emissivity
Industrial applications
Laser radiation
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