Poster + Paper
27 August 2024 Design and commissioning of a UHV sputter system for the fabrication of superconducting TiN KIDs using high power impulse magnetron sputtering
C. S. Woodhead, M. Tapia, C. Dunscombe, T. Brien, M. Baghoria, S. Doyle, P. Hargrave
Author Affiliations +
Conference Poster
Abstract
Titanium nitride (TiN) is an ideal material for fabricating Kinetic Inductance Detectors (KIDs), firstly due to its relatively high and tuneable critical temperature, and secondly its high normal-state resistivity, which allows for a large kinetic inductance and responsivity. However, fabricating large arrays on wafers greater than 150 mm can be challenging due to TiN films being very sensitive to changes in stoichiometry, thickness and contaminants. In this paper we demonstrate a novel technique for making high quality films of superconducting TiN via the use of a high impulse magnetron sputtering technique (HIPIMs) in conjunction with a custom built ultra-high vacuum environment. We detail the design principles of the UHV-HIPIMS sputter system and show that films of high uniformity suitable for use in KID arrays can be achieved.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
C. S. Woodhead, M. Tapia, C. Dunscombe, T. Brien, M. Baghoria, S. Doyle, and P. Hargrave "Design and commissioning of a UHV sputter system for the fabrication of superconducting TiN KIDs using high power impulse magnetron sputtering", Proc. SPIE PC13102, Millimeter, Submillimeter, and Far-Infrared Detectors and Instrumentation for Astronomy XII, PC1310213 (27 August 2024); https://doi.org/10.1117/12.3019852
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KEYWORDS
Semiconducting wafers

Tin

Head

Superconductors

Sputter deposition

Technetium

Nitrogen

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