Chemical Mechanical Polishing

doi:10.1117/3.924283.ch12

Book: Introduction to Semiconductor Manufacturing Technology, Second Edition

Author(s): Hong Xiao

Published: 2012

https://doi.org/10.1117/3.924283.ch12

Author Affiliations +

Abstract

CMP is a removal process that strips small portions of film deposited on a wafer by a combination of chemical reaction and mechanical polishing, thus making the surface smoother and more planarized. It is also used to remove bulk dielectric film on the surface to form STI on the silicon substrate, and remove bulk metal film from the wafer surface to form metal interconnection lines or plugs in the dielectric film. This chapter covers CMP processes.