This chapter introduces the basics of semiconductor fabrication, including the basics of cleanroom, contamination control, yield, IC fab layout, testing, and packaging processes. Objectives After finishing this chapter, the reader will be able to:
2.1 Introduction IC chip fabrication is a very complicated and time-consuming process. It begins with an IC design, formed with the help of powerful electronic design automation (EDA) software. The layouts of the design are then verified and taped out. In a mask shop, a photoresist (PR) layer is coated onto a chrome glass plate, and the designed pattern is printed by an electron beam writer or a laser writer. After PR development, a chromium etch process is used to transfer the PR pattern to the chrome glass to form the mask or reticle. After cleaning and inspection, the masks are ready to be shipped to IC fabs. A single IC chip requires 20 to 30 masks, depending on the type of device and the technology node. |
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