Improved solid-state planar Ti/Pd/Ag/AgCl/KCl-gel microreference electrode by silicon cap sealing package

I-Yu Huang; Shih-Han Wang; Chi-Chih Chu; Chien-Tai Chiu

doi:10.1117/1.3196547

1 July 2009 Improved solid-state planar Ti/Pd/Ag/AgCl/KCl-gel microreference electrode by silicon cap sealing package

I-Yu Huang, Shih-Han Wang, Chi-Chih Chu, Chien-Tai Chiu

Author Affiliations +

Journal of Micro/Nanolithography, MEMS, and MOEMS, Vol. 8, Issue 3, 033050 (July 2009). https://doi.org/10.1117/1.3196547

Abstract

Although solid-state microreference electrodes (µREs) have been developed for electrochemical and biomedical sensing applications for more than one decade, there are very few studies devoted to improving their performance through packaging. Using planar technology and a silicon cap sealing method, we implement a packaged Ti/Pd/Ag/AgCl/KCl-gel µRE with a total dimension of only 9 mm (L)×6 mm (W)×1 mm (H), a hundredfold less than the commercial Ag/AgCl reference electrode (RE). Compared with the unpackaged µRE, the presented chip-level packaged µRE demonstrates many improved characteristics, including a very stable cell potential (5-mV drift voltage in 30,000 s), an approximately zero offset voltage (−7 mV), a very low impedance (1.50 kΩ) and phase shift (8.98 deg) at 1-kHz operation frequency, a very small double-layer capacitance (0.04 µF), and a very high reproducibility (±3.1-mV).

©(2009) Society of Photo-Optical Instrumentation Engineers (SPIE)

Citation Download Citation

I-Yu Huang, Shih-Han Wang, Chi-Chih Chu, and Chien-Tai Chiu "Improved solid-state planar Ti/Pd/Ag/AgCl/KCl-gel microreference electrode by silicon cap sealing package," Journal of Micro/Nanolithography, MEMS, and MOEMS 8(3), 033050 (1 July 2009). https://doi.org/10.1117/1.3196547

Published: 1 July 2009

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