Paper
7 March 2007 Use of silane-based primer on silicon wafers to enhance adhesion of edge-protective coatings during wet etching: application of the TALON Wrap process
J. Dalvi-Malhotra, G. J. Brand, X.-F. Zhong
Author Affiliations +
Abstract
Hydrolyzed silane primer solutions were made of an organosilane in glycolether diluted with a large amount of water with or without an acid as a catalyst. The newly developed primer compositions exhibited an extended shelf life of 3 months or more. The compositions were specially designed to accommodate ProTEKTM. layer adhesion in the TALON Wrap. process. In this application, a spin-coatable polymeric material, ProTEKTM., is applied as the protective coating to coat the top, edge, and underside rim of the wafer in preparation for backside etching. By applying an underlayer of primer and an overlayer of ProTEKTM. coating to the top, edge and the bottom side rim of the wafer, an effective encapsulation of the wafer was achieved by using a custom-designed baffle. Each layer was applied by spin coating followed by baking at a wide temperature range. Thermal processing was followed by wet etching in KOH at an elevated temperature for . 10 hr. Post-etched wafers were rinsed with deionized (DI) water. Excellent edge profiles without "knife-edges" were obtained after etching the unprotected areas of the wafer. The process is fully automated because it is carried out in the TALONTM automated wafer-processing tool. Intact films with no lifting or peeling were obtained during or after the KOH etch process/DI rinse for silicon substrates.
© (2007) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
J. Dalvi-Malhotra, G. J. Brand, and X.-F. Zhong "Use of silane-based primer on silicon wafers to enhance adhesion of edge-protective coatings during wet etching: application of the TALON Wrap process", Proc. SPIE 6462, Micromachining Technology for Micro-Optics and Nano-Optics V and Microfabrication Process Technology XII, 64620B (7 March 2007); https://doi.org/10.1117/12.693290
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CITATIONS
Cited by 7 scholarly publications and 15 patents.
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KEYWORDS
Semiconducting wafers

Etching

Silicon

Thin film coatings

Wet etching

Polymers

Chromatography

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