Thermal cracks in LTB:Cu luminescent ceramics are connected with the presence of air voids in the material, which decreases the heat conductance. Powder phosphor would be more stable against heat. The effects of sintering time, grinding, and subsequent annealing on the luminescence intensity are studied. Rough grinding decreases the efficiency by 15-20%, but this should be checked more thoroughly. Subsequent annealing does not affect the luminescence properties if the annealing temperature does not exceed 400 °C, but the luminescence yield decreases if the temperature exceeds 500 °C. Due to a large number of luminescence centers and a relatively small amount of electron traps, LTB:Cu should be tolerant of high radiation doses caused by bombardment with electrons in cathodoluminescent UV-radiation sources.
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