Photonics Research Ontario (PRO) is an Ontario Provincial Center of Excellence supporting a broad range of laser- processing activities within its photonics program. These activities are centered at the University of Toronto, and split between an industrial-user facility and the individual research programs of principal investors. The combined effort furnishes forefront laser system and advanced optical tools to explore novel processing applications in photonic, biomedical, and microelectronic areas. Facilities include laser micromachining stations, excimer-based mask-projection stations, extremely short wavelength lasers such as the molecular fluorine laser, and ultrafast laser systems. The latter two advanced laser offer interesting advantages and contrast in processing 'difficult' materials through linear and nonlinear absorption processes, respectively. These laser systems provide fine precision and strong interaction with a wide range of materials, including 'transparent' glasses, and also ceramics and metals. Applications fall broadly into several areas: wafer-level circuit trimming, high-resolution ultrasonic transducers, and the shaping of optical waveguides and Bragg-gratings for photonic components. This paper summarizes the laser-processing infrastructure and research activities at PRO.
Ablation rates and etched-surface morphology of fused silica has been studied with 1-ps Nd:glass laser pulses in a regime of near-diffraction-limited spot size. Shallow holes of 1.7- micrometers diameter were too small for the formation of laser- induced periodic-surface structures. Atomic-force and scanning-electron microscopy showed that reproducible etch depth and moderately smooth surfaces are attainable for low fluences of 5.5 - 45 J/cm2--the `gentle' ablation regime. Etch depth progressed linearly with the number of laser pulses until the onset of surface swelling and shock- induced microcracks after a critical number Nc of laser pulses, scaling as Nc equals 1.7 + 80/F (fluence F in J/cm2). Below this limit--for accumulated etch depths less than approximately 2 micrometers --3D surface structuring with sub-micron precision is possible with picosecond-laser pulses. In the strong ablation regime (F > 45 J/cm2), surface morphology was poor and microcracking developed within 2 - 4 pulses. These shock-induced microcracking effects were eliminated when a mode-locked train of approximately 400 identical 1-ps pulses, each separated by 7.5 ns, was applied. Very smooth and deep (approximately 30- micrometers ) holes of 7 - 10-micrometers diameter were excised at a total fluence of approximately 100 kJ/cm2, establishing a new means for rapid and precise micromachining of fused silica and other brittle materials.
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