Multi-wavelength (MWL) micro diffraction-based overlay (μDBO) is a prominent method for after-develop inspection (ADI) overlay measurements, which is favorable for accuracy and robustness. Continuous-bias DBO (cDBO) is expected to offer robustness improvements against stack variation, asymmetry, and imbalance. In this paper, dual-WL (DWL) cDBO profiles were evaluated to secure the advantages of both of MWL and cDBO applications. The metrics used to evaluate accuracy and robustness of ADI overlay measurements are residual, dynamic precision (DP), and wafer-to-wafer variation of the difference between ADI and after-etch inspection overlay. 70% of DWL profiles had improvements in their residual values comparing with their single-WL (SWL) constituents on Samsung R&D wafers in layer A. On layer B, the best DWL cDBO profiles showed around 5% improved residuals comparing with its SWL constituents. DWL cDBO showed around 30% averaged improved DP compared with SWL counterparts. DP improvements of MWL cDBO are following the expected DP improvements, based on the signal-to-noise ratio improvement with increasing number of signals. Residual improvement with increasing number of WLs is different from the DP improvement, and the best DWL residual improvement is higher than that of SWL measurements with noise reduction techniques applied. This shows that the residual improvement cannot be attributed to the increased number of acquisitions, and that it could be an innate advantage of MWL cDBO.
During metrology overlay recipe setup typically a wide range of different target designs are present to select from. The main goal of recipe setup is to select the most accurate target type-recipe combination at ADI (after develop inspection) without additional external information that can be used for production on a large set of wafers. We will introduce a method based on blind source separation to disentangle the contributions of target asymmetry and the overlay of the targets. Based on this separation, the most accurate target-recipe combination can be selected. On top of selecting the most accurate target-recipe combination, it is important to stabilize the difference between the overlay on device and the overlay as measured on the target. In order to increase that stability we will introduce advanced algorithms in the ADI measurements that use measured asymmetry parameters to correct for inline target asymmetry variation. We will show a metrology to device matching improvement of up to 40% on product wafers.
In next generation 3D-NAND devices, accurately determining after-etch overlay for the multi-layer stack is a major challenge. This is especially the case for the multi-tier 3D-NAND structures, where the overlay of the channel holes is an important performance parameter. The most commonly used after-etch metrology suffer both from the high aspect ratio of the channel holes and from the potential presence of large tilts.
Using In-Device Metrology (IDM), we show results of non-destructive overlay measurements on 3D-NAND memory holes. Once the overlay signal has been determined, the remaining asymmetry information in the measurement can be used to characterize tilt phenomena densely through the memory array.
Using hyper-dense in-device measurements show the overlay effects of intra-die stress. A new lithography scanner model is used to correct specifically for such intra-die overlay fingerprints.
This paper demonstrates the improvement using the YieldStar S-1250D small spot, high-NA, after-etch overlay in-device measurements in a DRAM HVM environment. It will be demonstrated that In-device metrology (IDM) captures after-etch device fingerprints more accurately compared to the industry-standard CDSEM. Also, IDM measurements (acquiring both CD and overlay) can be executed significantly faster increasing the wafer sampling density that is possible within a realistic metrology budget. The improvements to both speed and accuracy open the possibility of extended modeling and correction capabilities for control. The proof-book data of this paper shows a 36% improvement of device overlay after switching to control in a DRAM HVM environment using indevice metrology.
KEYWORDS: Digital watermarking, Distortion, Digital signal processing, Computer programming, Binary data, Signal processing, Associative arrays, Multiplexers, Quality measurement, Data hiding
Reversible watermarking is a technique for embedding data in a digital host signal
in such a manner that the original host signal can be restored in a bit-exact
manner in the restoration process. In this paper, we present a general framework
for reversible watermarking in multi-media signals. A mapping function, which
is in general neither injective nor surjective, is used to map the input signal
to a perceptually equivalent output signal. The resulting unused sample values of
the output signal are used to encode additional (watermark) information and
restoration data.
At the 2003 SPIE conference, examples of this technique applied to digital audio
were presented. In this paper we concentrate on color and gray-scale images.
A particular challenge in this context is not only the optimization of rate-distortion,
but also the measure of perceptual quality (i.e. the distortion). In literature
distortion is often expressed in terms of PSNR, making comparison among different
techniques relatively straightforward. We show that our general framework for
reversible watermarking applies to digital images and that results can be presented
in terms of PSNR rate-distortions. However, the framework allows for more subtle
signal manipulations that are not easily expressed in terms of PSNR distortion.
These changes involve manipulations of contrast and/or saturation.
The illegal copying of movies in the cinema is now common practice. Although the quality is fairly low, the economic impact of these illegal copies can be enormous. Philips' digital cinema watermarking scheme is designed for the upcoming digital cinema format and will assist content owners and distributors with tracing the origin of illegal copies. In this paper we consider this watermarking scheme in more detail. A characteristic of this watermarking scheme is that it only exploits the temporal axis to insert a watermark. It is therefore inherently robust to geometrical distortions, a necessity for surviving illegal copying by camcorder recording. Moreover, the scheme resists frame rate conversions resulting from a frame rate mismatch between the camcorder and the projector. The watermarking
scheme has been tested in a 'real' digital cinema environment with good results.
KEYWORDS: Digital watermarking, Computer programming, Signal processing, Signal detection, Sensors, Quantization, Error analysis, Modulation, Digital signal processing, Data hiding
A digital watermark can be seen as an information channel, which is hidden in a cover signal. It is usually designed to be imperceptible to human observers. Although imperceptibility is often achieved, the inherent modification of the cover signal may be viewed as a potential disadvantage. In this paper, we present a reversible watermarking technique for digital audio signals. In our context reversibility refers to the ability to restore the original input signal in the watermark detector. In summary, the approach works as follows. In the encoder, the dynamic range of the input signal is limited (i.e. it is compressed), and part of the unused bits is deployed for encoding the watermark bits. Another part of these bits is used to convey information for the bit-exact reconstruction of the cover signal. It is the purpose of the watermark detector to extract the watermark and reconstruct the input signal by restoring the original dynamic range. In this study we extensively tested this new algorithm with a variety of settings using audio items with different characteristics. These experiments showed that for 16bit PCM audio, capacities close to 1-bit per sample can be achieved, while perceptual degradation of the watermarked signal remained acceptable.
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