A novel inverse approach is proposed for in situ measurement of gas diffusion properties of polymeric seals used in microelectromechanical systems (MEMS) packages. The cavity pressure evolution of a polymer-sealed MEMS package subjected to a constant bombing pressure is documented as a function of time using classical interferometry, and the diffusion properties of the polymeric seal are subsequently determined from the measured pressure history. A comprehensive numerical procedure for the inverse analysis is established considering three diffusion regimes that characterize the leak behavior through a polymeric seal. The method is implemented to determine the helium diffusivity and solubility of a polymeric seal.
A novel inverse approach based on an optical leak test is developed and implemented for in-situ measurement of gas
diffusion properties of polymeric seals used in MEMS packages. Cavity pressure evolution during a leak test is
documented as a function of time using laser-based interferometry, and the diffusion properties of a polymeric seal are
subsequently determined from the measured pressure history. A comprehensive numerical procedure for the inverse
analysis is established considering three diffusion regimes that characterize the leak behavior through a polymer seal.
The method is demonstrated successfully to determine the helium diffusivity and solubility of the polymeric seal used in
a package.
An analysis method for fine leak batch testing is developed for effective hermeticity inspection of metal-sealed MEMS
packages in a mass production environment. It employs a forward-stepwise regression analysis based on a physical gas
flow model to infer the information of leaky packages from batch test data. The proposed method can determine
accurately the number of leaky packages and the true leak rate of each leaky package when the number of leaky
packages in a batch is less than 5. A top-down hierarchical batch test is proposed as a reliable and effective test scheme
by addressing this limitation of the developed analysis scheme.
The contrast of shadow moiré at high-order Talbot distances is studied. An exact solution for the contrast of shadow moiré fringes is developed from the diffraction phenomenon and its validity is corroborated experimentally. The result is combined with an additional effect from the finite aperture of the camera to propose a complete expression for the contrast of shadow moiré fringes. The results can guide the design of shadow moiré configurations with high-order Talbot distances for high-sensitivity measurements.
An IR diffraction interferometer is proposed for coplanarity measurement of high-density solder bump patterns. The method utilizes long-wavelength (= 10.6 µm) coherent infrared laser light, which serves to reduce the apparent roughness of test objects and enables the regularly spaced solder bump arrays to produce well-defined diffracted wavefronts. A single diffracted wavefront is isolated by an optical system and directed to interfere with a reference wavefront to produce a whole-field map of bump topography. An optical configuration similar to classical Fizeau interferometry is implemented to prove the concept.
A whole-field in-plane displacement measurement method was developed for micromechanics studies. The method increased the sensitivity of conventional moiré interferometry by an order of magnitude. The increased sensitivity was achieved by a two-step process. Microscopic moiré interferometry, used for step 1 to map an original displacement field, provided a basic sensitivity of 4.8 fringes/μm displacement, which exceeds the previously conceived theoretical limit. Optical/digital fringe multiplication method (ODFMM) was implemented for step 2 to achieve further enhancement of sensitivity. The ODFMM consists of optical fringe shifting and a digital process to sharpen and combine the shifted fringes. The result is a map with p times as many fringe contours as the original map of step 1. A factor of β = 12 was achieved, providing a sensitivity of 57.6 fringes/μm displacement, which corresponds to that of moiré with 57,600 lines per mm (1,463,000 lines per in.). The optical, mechanical, and electronic systems implemented here are remarkably robust and quick. The method is demonstrated by three practical applications: fiber/matrix deformation of a metal/matrix composite, interface strains in a thick 0/90-deg graphite/epoxy composite, and thermal deformation around a solder joint in a microelectronic subassembly.
An ultra-high sensitivity whole-field in-plane displacement measurement method was developed for micromechanics. It is called the optical/digital fringe multiplication method, or O/D multiplication method. The specific objective was displacement sensitivity of 50 nm per fringe contour or better, which corresponds to that of moiré with 20,000 lines per mm or more. The objective was achieved by a two-step process. Microscopic moiré interferometry was used for step 1 to map an original displacement field, which provides a sensitivity of 208 nm per fringe order. For step 2, a fringe multiplication scheme was implemented. Here, an automatic fringe shifting and fringe sharpening scheme was developed, wherein βN fringe contours are produced, where N is the fringe order in the basic moiré pattern and β is a fringe multiplication factor. A factor of 12 was achieved, providing a sensitivity of 17 nm per fringe contour. This corresponds to moiré with 57,600 lines per mm (1,463,000 lines per in.), which exceeds the sensitivity objective. The optical, mechanical and electronic systems implemented here are remarkably robust and quick. The method was applied to three practical applications: fiber/matrix deformation of a metal/matrix composite, interface strains in a thick 0°/90° graphite/epoxy composite, and thermal deformation around a solder joint in a microelectronic subassembly.
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