The key issues of local-area-network (LAN) and storage-area-network (SAN) applications are to improve cost, manufacturability and reliability of optoelectronic devices in high speed transmission. The authors have demonstrated highly manufacturability, reliability and thermal stability mini-transmitter for 10Gb/s Ethernet applications in this paper. Passive alignment technology is a way to improve manufacturability of optoelectronic devices in the future. However, the assembly yield rate of conventional LD chip on silicon optical bench to fiber is quite limited due to restricted optical alignment tolerance (< 1μm). In this study, a novel two lens structure of 10Gb/s LC receptacle type optical mini-flat transmitter is designed and demonstrated to exhibit above 20% coupling efficiency with less than ±6um aligned deviation. Moreover, a high resistivity silicon optical bench (1kΩ/cm) and pressure-free bonding technique using the electroplated AuSn solder are also adopted to guarantee the transmitted performance in high frequency operation. The eye diagram of 10Gb/s mini-flat transmitter developed in this study showing the excellent quality obtained passing 10Gb/s Ethernet mask test with 20% margin. And the extinction ratio of transmitter is also proved to above 6dB at room temperature. The response of monitor PD is also examined up to 80% by mirror coating on silicon V-groove. Thermal stability of 10Gb/s mini-flat transmitter is another critical issue in high speed transmission. The performance of temperature stabilized transmitter over wide case temperature range is also evaluated in this study. The optical eye diagram of 10Gb/s transmitter developed in this paper showing excellent eye quality passing 10Gb/s Ethernet mask test between 0°C to 80°C. Finally, the reliability of transmitter is also performed. The reliability data indicate that the optical alignment of these modules are stable and observed essentially low variations in optical coupling as results of 1000 hours damp heat and 1000 temperature cycling durations.
With the drastic expansion of internet usage, the demand of 10Gbps transmission optoelectronic devices for local-area-network (LAN) and storage-area-network (SAN) are increasing. The key issues of these applications are to improve cost, manufacturability and reliability of optoelectronic devices in high speed transmission. The authors have demonstrated highly manufacturable and reliable optical front end and trasneiver module for 10Gbps Ethernet applications in this paper.
TO-Can package is a way to reduce cost of 10Gbps optical assembly. However, the signal integrity of high speed transmitter optical sub-assembly (TOSA) and receiver optical sub-assembly (ROSA) are limited due to the mismatched characteristic impedance, parasitic inductance and spread capacitance of conventional TO-Can package. In this paper, high performance and high sensitivity of 10Gbps TOSA and ROSA with TO-Can package are discussed and demonstrated to overcome the critical issues mentioned, respectively. In order to improve the signal integrity and manufacturability of 10Gbps OSA in 10Gigabit Ethernet small form factor transceiver module assembly. The authors also integrate high speed flex board and OSA package to extend the signal path, and to minimize the effect of crosstalk in module.
The high speed transceiver modules with TO-Can package embedded compliant with XFP multi-source agreement (MSA) are also demonstrated in this paper. The performance of temperature-stabilized transceiver module over awide case temperature range is tested. The optical eye diagram of 10Gbps transmitter developed in this study shows an excellent quality passing the 10Gbps Ethernet mask test between 0 degrees Centigrade and to 70 degrees Centigrade. Finally, the reliability tests regulated by Telcordia GR-468-CORE and MIL-STD-883 are also performed and certified to pave the ways of highly manufacturable and reliable XFP transceiver modules for 10Gbps Ethernet applications.
With the drastic expansion of internet usage, the demand of 10Gb/s transmission optoelectronic devices for local-area-network (LAN) and storage-area-network (SAN) are increasing. The key issues of these applications are to improve cost, manufacturability and reliability of optoelectronic devices in high speed transmission. The authors have demonstrated extremely low cost, high manufacturability and thermal stability optical fron-end for 10Gb/s Ethernet applications in this paper. High performance and high sensitivity of 10Gb/s transmitter optical sub-assembly (TOSA) and receiver optical sub-assembly (ROSA) with TO-Can packages are discussed and demonstrated to overcome the critical points in high speed applications, respectively. Moreover, 10km interconnection of 10Gb/s optical front-end without isolated elements inside are also proved to be error free at 10.3125Gb/s. In order to improve the signal integrity and manufacturability of 10Gb/s OSA in small form factor transceiver modules assembly, the authors also integrate high speed flex board and OSA package to extend the signal path, and to minimize the effect of crosstalk in modules. Furthermore, the integration of flex board and OSA package more release the difficulties in conjuunction OSA and electrical sub-assembly (ESA) in module to fulfill the request of 10Gb/s transeivers' Multi-Source Agreement (MSA). The performance of temperature stabilized TOSA over wide case temperature range is also experimented. The optical eye diagram of 10Gb/s TOSA developed in this study showing excellent eye quality passing 10Gb/s Ethernet mask test between 0°C to 85°C.
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