Dr. David B. Graves Profile

Dr. David B. Graves

at Princeton Plasma Physics Lab

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Publications (8)

Proceedings Article | 22 February 2021 Presentation

Non-equilibrium plasma science and industries of the future

David Graves

Proceedings Volume 11615, 116150I (2021) https://doi.org/10.1117/12.2587120

KEYWORDS: Plasma, Manufacturing, Thin films, Semiconductors, Quantum communications, Thin film manufacturing, Thin film devices, Silicon, Quantum information, Integrated circuits

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PPPL recently launched a new initiative in non-equilibrium plasma (NEP) science and technology with a focus on applications associated with key industries of the future (IotF), including semiconductor integrated circuit (IC) device manufacturing and materials associated with quantum information science (QIS). Multisector, cross-community partnerships with leading U.S. plasma semiconductor equipment suppliers and Princeton University have been started to support this initiative. The main challenge for NEP technologies in IC manufacture is atomistic control of chemical and material transformations at surfaces. This capability is also needed for future QIS device manufacturability, so fundamental research on NEP for future IC device manufacture is directly applicable to practical manufacturing of QIS devices. The big challenge for NEP is that it is chemically complex and often difficult to control. It took decades of research and development by plasma, surface, materials and device scientists and engineers to approach nm-scale precision processing with Si-based materials. The task of developing nm-scale processes for Si device manufacture is not complete, but next-generation IC manufacturing will also require significant changes in materials: i.e. 'post-Si materials.' The combination of new materials and increasingly, atomistic precision, challenges the current state-of-the-art in plasma technologies used for IC manufacture today. There are even bigger challenges for QIS materials and devices, especially when contemplating the need for developing devices with thousands or even millions of qubits. QIS devices can be made in multiple ways, but thin film approaches, based on existing IC manufacturing technology, have perhaps the best chance to manufacture at scale. Plasma technology is ubiquitous in QIS material fabrication involving thin film approaches, but plasma processes tend to create parasitic qubits and other serious atomic-scale defects. Solving these problems will require considerable research efforts - probably on a multi-decade timescale. In order to be successful, plasma scientists must work closely and collaboratively with specialists in surfaces, materials and devices. In this talk, I will outline the current and future plans for this new collaborative initiative at PPPL.

Proceedings Article | 23 March 2016 Paper

Interactions between plasma and block copolymers used in directed self-assembly patterning

Stephen Sirard, Laurent Azarnouche, Emir Gurer, William Durand, Michael Maher, Kazunori Mori, Gregory Blachut, Dustin Janes, Yusuke Asano, Yasunobu Someya, Diane Hymes, David Graves, Christopher Ellison, C. Grant Willson

Proceedings Volume 9782, 97820K (2016) https://doi.org/10.1117/12.2220305

KEYWORDS: Plasma, Polymers, Etching, Silicon, Optical lithography, Plasma etching, Tin, FT-IR spectroscopy, Directed self assembly, Reactive ion etching, Picosecond phenomena, Polymethylmethacrylate

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Proceedings Article | 6 November 2009 Paper

Plasma characterization of Tetra III chrome etch system

Michael Grimbergen, D. G. Nest, Keven Yu, T. Y. Leung, Madhavi Chandrachood, Alan Ouye, Saravjeet Singh, Ibrahim Ibrahim, Ajay Kumar, David Graves

Proceedings Volume 7488, 74880L (2009) https://doi.org/10.1117/12.833490

KEYWORDS: Plasma, Ions, Etching, Electrodes, Argon, Chlorine, Plasma etching, Emission spectroscopy, Ceramics, Ultraviolet radiation

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Proceedings Article | 28 March 2007 Open Access

Collaborative platform, tool-kit, and physical models for DfM

Andy Neureuther, Wojtek Poppe, Juliet Holwill, Eric Chin, Lynn Wang, Jae-Seok Yang, Marshal Miller, Dan Ceperley, Chris Clifford, Koji Kikuchi, Jihong Choi, Dave Dornfeld, Paul Friedberg, Costas Spanos, John Hoang, Jane Chang, Jerry Hsu, David Graves, Alan Wu, Mike Lieberman

Proceedings Volume 6521, 652104 (2007) https://doi.org/10.1117/12.721199

KEYWORDS: Design for manufacturing, Photomasks, Device simulation, Computer aided design, Process modeling, Etching, Monochromatic aberrations, Manufacturing, Lithography, Chemical mechanical planarization

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Proceedings Article | 16 April 1993 Paper

Modeling of high-density plasma sources

David Graves, Han-Ming Wu, Robert Porteous

Proceedings Volume 1803, (1993) https://doi.org/10.1117/12.142910

KEYWORDS: Electrons, Ions, Plasma, Magnetism, Ionization, Microwave radiation, Picosecond phenomena, Particles, Throat, Velocity measurements

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Proceedings Article | 1 June 1992 Paper

Planarization of spin-coated films

Loni Peurrung, David Graves

Proceedings Volume 1674, (1992) https://doi.org/10.1117/12.130353

KEYWORDS: Semiconducting wafers, Coating, 3D modeling, Capillaries, Optical lithography, Microfluidics, Interferometry, Pulsed laser operation, Microscopes, Cameras

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Proceedings Article | 1 January 1992 Paper

Particle spatial distributions in low-pressure discharges

John Daugherty, Michael Kilgore, David Graves

Proceedings Volume 1594, (1992) https://doi.org/10.1117/12.56651

KEYWORDS: Particles, Plasma, Ions, Electrodes, Process control, Scattering, Light scattering, Clouds, Electrons, Aluminum

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Proceedings Article | 1 July 1991 Paper

Origins of asymmetry in spin-cast films over topography

Loni Manske, David Graves

Proceedings Volume 1463, (1991) https://doi.org/10.1117/12.44800

KEYWORDS: Capillaries, Semiconducting wafers, Coating, Microfluidics, Optical lithography, Solids, Interferometry, Pulsed laser operation, Microscopes, Cameras

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Showing 5 of 8 publications

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