Commercial introduction of emerging integrated photonics technologies requires a long and complex multi-layer product development, industrialization, and qualification cycles at all levels of value chain from initial product design, material sourcing, component-system-module manufacturing, and testing, through marketing and delivery of new products to the market. Scalable assembly and packaging of electronic-photonic integrated modules is important and may take more than a half of the entire product’s costs. In this paper, we will report on some of our industrial processes for scalable photonics packaging, as well as challenges and results obtained from our research and innovation projects.
Photonic integrated circuits (PICs) are one of the key enablers for beyond 5G networks. A novel generation of fully integrated photonic-enabled transceivers operating seamlessly in W- D- and THz-bands is developed within the EU funded project TERAWAY. Photonic integration technology enables key photonic functionalities on a single PIC including photonic up/down conversion. For efficient down-conversion at the photonic integrated receiver, we develop the first waveguide-fed photoconductive antenna for THz communications. Finally, we report on the experimental implementation of a fully photonic-enabled link operating across W- D- and THz-bands.
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