Industrial high-power/high-brightness blue diode lasers are quickly becoming a preferred laser source for processing highly reflective materials such as copper, stainless steel, and Aluminum.This paper focuses on the recent advances applying Wavelength Beam Combining (WBC) technology to diode bars emitting in the 445nm region. We will present results from latest developments in power scaling introducing an 800W Blue laser coupled with fiber diameters ≤50um while providing a beam parameter product of < 2.2 mm*mrad. Next, we will share applications results using these blue lasers at various power levels in a variety of processes including micro welding and engraving, conduction mode welding, keyhole welding and cutting of thin metal sheets.Finally, we will discuss the future of this technology regarding power scaling beyond 800W and combining our blue laser sources with multi-kilowatt high brightness diode lasers operating in the 975nm region to achieve improved applications results.
Blue High-Power/High-Brightness Direct Diode Lasers are rapidly evolving as one of the preferred laser technologies for processing highly reflective materials. This paper focuses on the recent advances applying Wavelength Beam Combining (WBC) technology to diode bars emitting in the 445nm region to demonstrate the power scalability with high beam qualities only achievable using WBC technology. We’ll present our latest developments including 400W Blue lasers coupled with fiber diameters ≤50um. We will also show results of combining multiple laser modules to scale powers to multi-KW levels with fiber diameters ≤ 100um. Finally, we will discuss the future of this technology.
KEYWORDS: Semiconductor lasers, High power diode lasers, Laser systems engineering, Laser applications, High power lasers, Reliability, Manufacturing, Continuous wave operation
High Power Diode Laser Bars serve as the foundation for many high-power laser systems used in manufacturing and research. Efficient heat removal is essential for reducing cost per watt by increasing available output power or extending the effective lifetime of these devices. In this paper we will introduce a novel method for electrically isolated water impingement cooling of high-power diode laser bars operating in the 975nm region. We will present results from 58 emitter diode laser bars operating in the 975nm region with CW output power levels exceeding 500W and a thermal resistivity of less than 0.12 K/W.
Industrial High-Power/High-Brightness Direct Diode Laser (DDL) are rapidly evolving as one of the preferred laser technologies for metal processing with several benefits such as higher processing speeds, superior applications quality and wall plug efficiencies higher than 40%. This paper focuses on the recent advances applying Wavelength Beam Combining (WBC) technology to diode bars emitting in the 400nm region to demonstrate the power scalability with beam qualities only archivable using WBC technology. Also, will talk about the 6kW/100um laser in the 975nm region using the Fast-Beam-Shaper (FBS) capable of dynamically and continuously changing the shape of the beam in a couple of milliseconds to shape-modulate the output beam to closely match the application requirements. We will also show an approach for a 6kW/50um extended broadband laser in the 875-1000nm spectral region that doubles the brightness capabilities of DDL and enhance the metal processing quality.
This paper presents our latest experimental results of welding and cutting of steel and aluminum using a High Power, High Brightness Direct Diode Laser (DDL) upgraded with a Laser-Integrated Dynamic Beam Shaper (DBS). TeraDiode’s DDLDBS laser system transforms the beam distribution from Gaussian-like to Doughnut shape, and a beam parameter product from 4 to 25mm·mrad and doing so in a continuous, real-time manner with very low latency below 10ms. These capabilities unlock a wide range of processing parameters and an overall improved quality for metal cutting and welding while using simplified processing heads. This capability can be applied to DDL from 500W to 8000W power range.
The recent 1μm-laser cutting market is dominated by fiber and disk lasers due to their excellent beam quality of below 4mm*mrad. Teradiode’s 4kW direct diode laser source achieves similar beam quality while having a different beam shape and shorter wavelengths which are known for higher absorption rates at the inclined front of the cutting keyhole. Research projects, such as the HALO Project, have additionally shown that polarized radiation and beams with shapes different from the typical LG00 lead to improved cut quality for ferrous and non-ferrous metals. [1] Diode laser have the inherent property of not being sensitive to back reflection which brings advantages in cutting high-reflective materials. The II-VI HIGHYAG laser cutting head BIMO-FSC offers the unique feature of machine controlled and continuous adjustment of both the focus diameter and the focus position. This feature is proven to be beneficial for cutting and piercing with high speed and small hole diameters. In addition, the optics are designed for lowest focus shift.
As a leading laser processing head manufacturer, II-VI HIGHYAG qualified its BIMO-FSC MZ (M=magnification, Z=focus position) cutting head for Teradiode’s 4kW direct diode laser source to offer a cutting-edge solution for highpower laser cutting. Combining the magnification ability of the cutting head with this laser source, customers experience strong advantages in cutting metals in broad thickness ranges. Thicknesses up to 25mm mild steel can easily be cut with excellent edge quality.
Furthermore, a new optical setup equivalent to an axicon with a variable axicon angle is demonstrated which generates variable sized ring spots. The setup provides new degrees of freedom to tailor the energy distribution for even higher productivity and quality.
Modern high power industrial CO2 lasers are the result of decades of technological advancements aimed to improve laser parameters such as gain and saturation intensity to obtain the best power extraction efficiency. In this paper a resonator optimization approach is presented that includes laser power stability as one of the criteria for selecting the best configuration. This approach is applied to a hybrid stable-unstable annular RF excited CO2 laser.
The influence of a variety of parameters, such as the gas composition, pressure and lateral variation of Joule heat release
of the discharge at employed frequency, are taken into account to derive a distributed thermal lensing expression and to
numerically calculate the focal length as a function of position within the inter-electrode gap. The process of widening of
the beam inside the resonator is investigated by means of complex ray methodology. The findings are incorporated into
the optimization process of the optical resonator in the stable direction and the impact on the beam quality and power
stability is verified by experimental results.
A comprehensive investigation of the main parameters that determine the effective power scaling of diffusion cooled
annular CO2 lasers in the 3kW region is presented. Aspects such as RF excited discharge characteristics; small signal
gain, free space resonator configuration, beam stability and quality are discussed in detail. Simulations of the resonator
system are presented and different shapes for the azimuthal direction are evaluated for power and stability.
Presented is a study of a coaxial, hybrid-stable-unstable resonator for high power lasers. The coaxial configuration
allows the realization of the outcoupling and rear mirror in one mechanical structure with the incorporation of an axicon
mirror with retroreflective characteristics as an intra-cavity folding mirror. The design of the stable direction is
investigated to optimize the set-up for best beam quality and minimized alignment sensitivity. Additionally, the instable
direction is examined to achieve an even heat load on the mirrors. Simulations of the laser structure are performed and
compared to measurements.
Laser drilling has become a common processing step in the fabrication of printed circuit boards (PCB's). For this work, a recently developed enhanced peak power CO2 laser (~2.5 kW peak power, 200W average) or ultra-super pulse (USP) laser is used to drill alumina and copper coated dielectric laminate materials. The higher peak power and faster response times (than conventional CO2 lasers) produced by the USP laser are used to produce high speed alumina laser scribing and copper coated laminate microvia drilling processes. Alumina is a common PCB material used for applications, where its resistance to mechanical and thermal stresses is required. Here we present a comprehensive study of the melt eject mechanisms and recast formation to optimise the speed and quality of alumina laser scribing. Scribe speeds of up to 320 mms-1 (1.8 times current scribe rate) have been achieved using novel temporal pulse shapes unique to the USP laser. Also presented is the microvia drilling process of copper dielectric laminates, where the multi-level configuration presents different optical and thermal properties complicating their simultaneous laser ablation. In our experiments the USP laser has been used to drill standard thickness copper films (up to 50 μm thick) in a single shot. This investigation concentrates on understanding the mechanisms that determine the dielectric undercut dimensions.
A technique for localised damage repair of fused silica optical surfaces has been investigated. The study reports the use of a CO2 laser system at 10.6μm wavelength with 50&mum spot diameter (measured at 1/e2) and pulse duration ranging from 50μs to 200ms. Data of the threshold axial irradiance for the onset of measurable mass loss were produced and compared with heat flow calculations based in "hot" properties of silica, showing a changeover from predominantly 1-d cooling below 300µs to quasi-steady-state 2-d cooling beyond 1ms. Typically, irradiances of about 90% of the threshold for mass loss are then used. Surface melt spots generated with a single laser pulse are found to produce measurable cleaning of the initial polishing swirls and light scratches (~tens of nm deep) at all pulse lengths investigated. A reproducible reference scratch of 1.5μm width and 100-200nm depth made by diamond scribing has been used to simulate smoothing or closing of crack-like features. To fully remove the test scratch requires multiple applications of long pulses. Finally, smoothing of the groups of micron-size surface pits caused by optical damage has been obtained, removing significantly the relative amplitude at high frequencies of the fast Fourier transform with a lower limit of 200 cycles/mm for the 50μm spotsize.
CO2 laser drilling of the resin coated copper (RCC) layers of laminated circuit boards has been investigated at different
fluence levels. The threshold fluence for copper layer drilling is found to be 570 Jcm-2 for 5μm and 1500 Jcm-2 for 12μm copper thickness, using laser pulses in the 10 μs and 20 μs FWHM respectively. Undercut in the resin layer is found to primarily depend on the amount of excess energy in the pulse tail. Methods to reduce the pulse decay time have been investigated, giving smaller diameter breakthrough holes close to threshold, which should aid the control of hole drilling in RCC. High-speed videography has been used to verify the observations of post-processing analysis.
Laser power capability, pulsing issues and beam quality issues associated with multi-line operation have been investigated for a carbon monoxide planar waveguide laser with a negative branch unstable resonator operating at room temperature, and producing output laser power of 300W.
We review progress in the development of a novel mode of operation of the planar waveguide carbon dioxide laser (referred to as the ultra-super-pulse or USP mode), which is capable of delivering, at high efficiency, up to ten times higher peak power and up to ten times shorter pulse duration than the 'conventional' planar waveguide laser. These enhanced bream properties extend the range of applications to the micro-processing of materials with higher machining threshold and/or low absorption coefficients and with the added advantage of producing reduced heat affected zone.
The problem of line-hoppng in a short cavity, slab waveguide CO2 laser is studied by modeling of the laser signature and the experimental determination of laser spectra. It is shown that small increments of resonator length, less than 100 µm, significantly change the number of lines in the spectra and at a specific resonator length near 408.7 mm there is the possibility of single line operation. To reduce line-hopping and lock the laser to the 10P20 line, a 10th order, 2 dimensional grating has been laser engraved on one surface of the planar waveguide.
The peak power and gain available from the RF excited planar waveguide CO2 laser has been enhanced for pulses in the 10 to 100 ?s range at pulse repetition rates up to 4 kHz. The specific peak power output for unit electrode area has been enhanced to a value of240 kW.m-2 . Relative to cw, the small signal gain coefficient has been pulse enhanced by a factor of 7 to 2.5 m-1
The composite beam from a 64-element carbon dioxide array laser, which produces an average power output of 2 kW, has been used in a series of surface processing experiments. In one set of experiments related to nuclear power station decommissioning, the array beam has been used to process the surface of a range of different density concrete materials. Scabbling trials have achieved concrete removal rates of approximately 1200 cm3hr-1kW-1 and average scabble depths of approximately 5 mm with incident power densities as low as 80 Wcm-2.
A high power, two-dimensional, 16 by 4 element waveguide array carbon-dioxide laser is presented and properties such as beam quality and spatial power distribution are assessed, together with beam reformatting techniques to produce compact beams.
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