Accurately predicting the hygroscopic behavior of composite materials is of great significance for the reliability design and life assessment of composite products. In this paper, a method was proposed for mesoscopic modeling and simulation of the hygroscopic behavior of composites based on fiber arrangement image features. Benefiting from the method the problem was solved that the classical model cannot take into account the influence of fiber arrangement mode on moisture absorption rate. The distribution laws were discussed on moisture absorption rate at different moments and different paths, and the differences were compared between the fiber order-arrangement and disorder-arrangement models. The simulation results showed that the obstruction of water molecule diffusion was more severe in the disorder-arrangement model established from the fiber arrangement images, and the moisture absorption rate of the composite was lower than that of the order-arrangement model. Finally, the accuracy of the disorder-arrangement model was verified by two groups of hygroscopic experiments at temperatures of 40°C and 80°C, respectively. The prediction accuracy of the model for the moisture absorption curve reached more than 0.92.
By using a numerical simulation of the 90° peel test, the laws of the load-displacement curves of the peeling process with various fracture strengths, fracture energies, and material parameters were examined. This analysis was based on the bilinear cohesive zone model to describe the adhesive performance of the aluminum-composite interface. The cohesive model parameters of the adhesive interface between aluminum and composites were derived, and a technique was devised to infer the fracture strength backward from the test results of peel strength. Normal pull-out experiments were used to validate the established cohesiveness model and the resulting values. Only slightly more than 4.3% differs between the experimental and simulation values of the critical parameter fracture strength. The findings serve as a reference for forecasting the behavior of adhesive interfaces between aluminum composites and for addressing the issue of measuring the fracture strength of adhesive interfaces in situations when the adhesive bond between composite layers is weak.
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