Prof. Guna S. Selvaduray Profile

Prof. Guna S. Selvaduray

Professor at San Jose State Univ

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Proceedings Article | 16 January 2003 Paper

Utilization of Pb-free solders in MEMS packaging

Guna Selvaduray

Proceedings Volume 4980, (2003) https://doi.org/10.1117/12.478555

KEYWORDS: Tin, Microelectromechanical systems, Lead, Microelectronics, Copper, Silver, Solids, Manufacturing, Reliability, Patents

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Soldering of components within a package plays an important role in providing electrical interconnection, mechanical integrity and thermal dissipation. MEMS packages present challenges that are more complex than microelectronic packages because they are far more sensitive to shock and vibration and also require precision alignment. Soldering is used at two major levels within a MEMS package: at the die attach level and at the component attach level. Emerging environmental regulations worldwide, notably in Europe and Japan, have targeted the elimination of Pb usage in electronic assemblies, due to the inherent toxicity of Pb. This has provided the driving force for development and deployment of Pb-free solder alloys. A relatively large number of Pb-free solder alloys have been proposed by various researchers and companies. Some of these alloys have also been patented. After several years of research, the solder alloy system that has emerged is based on Sn as a major component. The electronics industry has identified different compositions for different specific uses, such as wave soldering, surface mount reflow, etc. The factors that affect choice of an appropriate Pb-free solder can be divided into two major categories, those related to manufacturing, and those related to long term reliability and performance.

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