The traceability efforts are important for instance automotive and medical applications where critical components must be validated and monitored during their lifetime. This enables to precisely backtrack individual devices and product groups in case of failure and thereby significantly reduce costs in case of product recalls. The digital lithography system was employed for patterning of the die annotations accomplishing 50×50μm DataMatrix codes by using high resolution RGB resists.
High–volume–capable Maskless Exposure technology is demonstrated to deliver fast and individualized production abilities for micro-optical applications, individual device labelling and micro–structuring of novel RGB–colored photoresists at the die level. Dynamic alignment enables real–time distortion compensation and adaptive repositioning of sub 2μm structures during write–time enabling novel possibilities for heterogenous integration and associated applications.
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