High power diode laser systems with homogenized intensity distribution have been widely used in laser annealing, cladding and surface heating. New applications such as semiconductor wafer annealing prefer adjustable laser beam size for process optimization, especially during process development stage. Here we report a development of a diode laser system with an adjustable beam size and highly uniform line beam intensity. Beam size in two dimensions perpendicular to its propagation direction can be adjusted independently with higher than 97% intensity uniformity in length dimension. The beam width is adjustable from 60 to 90um (FWHM) and the beam length is adjustable from 11mm to 12mm (FWHM). The output power can reach 1500W at 808nm wavelength with a power density reaches ~170KW/cm2. Detailed misalignment sensitivities of the Micro-Lens Arrays (MLAs), with respect to the lateral position, the rotating angle, and the distance between the two MLAs are studied. Beam back reflection isolation is also considered in the design to accommodate for high reflectivity materials processing. This new laser system can adapt to the requirement of different beam size quickly and precisely by simply adjusting the lens group position, without interrupting production process and increasing manufacturing cost.
Due to the maturity of VCSEL supply chain promoted by the VCSEL applications in smart phones, and the increasing peak power of multi-junction VCSEL chip,VCSELs are considered to have great advantages and potential as the transmitter light sources of automotive low-cost LIDAR devices. Here we introduce a kind of VCSEL line-beam module with unique optical shaping design for LiDAR applications. The module has a uniform line beam with a peak power larger than 200W, a pulse width of 4ns, a divergence angle of 0.12° @ 1/e2, and the vertical axis intensity uniformity is better than 80%. The experimental data showed that over a wide temperature range from - 40 °C to 110 °C the power variation of the line beam module is less than 20%, the variation of horizontal divergence angle is less than 5%, and the temperature drift coefficient is 0.066nm/°C, which greatly reduces the performance requirements of the receiver detector for the Lidar system. In addition, we introduce a prototype of new line-beam modules with peak power higer than 1000W we are developing, which can meet further requirement of long-distance LiDAR system.
Three products based on VCSEL chips are developed for intelligent driving Lidar and driver monitor system. The line beam products used for long-distance detection achieved a 0.1°horizontal divergence angle, 23° vertical divergence angle, and the vertical beam uniformity more than 80%. For the area beam products used in medium and short distance detection, has achieved the field of view 125°×25°. For the super wide field of view area beam product, can applied in driver monitor system, the FOV is 160°×120°. These three products all have excellent performance in a wide temperature range (- 40 degrees centigrade ~ 110 degrees centigrade).
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