Dr. Hyunwoo Hwang Profile

Dr. Hyunwoo Hwang

Senior Engineer at SAMSUNG ELECTRONICS CO.,LTD

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Publications (9)

Proceedings Article | 10 April 2024 Poster + Paper

Optical diffraction-based methodology to measure on-product EUV exposure focus variations

Willem op 't Root, Jungwan Park, Youngsun Nam, Seho Kim, Hyunwoo Hwang, Jeong Heung Kong, Sang-Ho Yun, Youngseog Kang, Bram Klaassen, Karel van den Bos, Zhe Hou, Aileen Soco, Don Cheon, Jong-Hyuk Yim, Hong-seung Song, Mi-Yeon Baek

Proceedings Volume 12955, 129552Q (2024) https://doi.org/10.1117/12.3010370

KEYWORDS: Semiconducting wafers, Metrology, Extreme ultraviolet lithography, Calibration, Extreme ultraviolet, Diffraction gratings, Scanners, Diffraction, Printing, Optical metrology

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Proceedings Article | 24 March 2017 Paper

Reticle heating feed-forward control (RHC2) on NXT:1980Di immersion scanner for enhanced on-product overlay

Young Ha Kim, Jonghoon Jang, Byeong Soo Lee, Hyunwoo Hwang, Youngsun Nam, Jeong-Heung Kong, Young Seog Kang, Se-Yeon Jang, Bart Paarhuis, Jeroen van der Wielen, Barry Moest, Joris Jongen, Stefan Weichselbaum, Niek Verbeek, Marco Stavenga, Roelof de Graaf, Richard Droste

Proceedings Volume 10147, 1014717 (2017) https://doi.org/10.1117/12.2259792

KEYWORDS: Reticles, Scanners, Distortion, HVAC controls, Optical alignment, Control systems, Thermal effects, Temperature metrology, Semiconducting wafers, Overlay metrology, Calibration

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Scanners in High-Volume-Manufacturing conditions will experience a large range of reticles that vary in reticle transmission and reticle diffraction characteristics. Especially under full production loads reticles will heat up due to the exposure light-load and as such experience thermo-mechanical deformations. The resulting reticle pattern distortion can be partially translated in a deteriorated overall system overlay. Due to the geometry of the reticle and exposure fields, these reticle thermal effects are in general barrel-shape distortions that can be well corrected with the available set of lens manipulators. Nevertheless node-over-node the residual overlay errors associated with thermo-mechanical reticle deformation needs further reduction since it contributes to the total onproduct overlay performance. To reduce overlay caused by reticle temperature drift, NXT1980Di includes an active cooling mechanism suppressing the reticle temperature changes during exposure significantly. Even though the reticle temperature excursions are well suppressed, residual intra-wafer overlay drift effect can still be observed. Before exposure of a wafer, reticle deformation is measured during reticle align using in-line alignment / image sensors (TIS or PARIS). This is enabled by adding alignment markers around the circumference of the image field on the reticle. The measured reticle deformations are then fed to the system control network and dynamically corrected for by making use of the available manipulators in the scanner and the projection lens. Wafer-by-wafer reticle distortion measurements are performed to accurately capture the transient dynamics present in reticle heating during normal production lots. A new version of Reticle Heating Feed-forward Control (RHC2) is introduced that uses reticle-heating-induced deformation measurements over time and exposure sequence information to calibrate reticle-deformation-predictionmodels. These models are based on thermo-mechanical models that simulate reticle deformation under various exposure conditions and are applied in-line to the exposures to reduce intra-wafer overlay drift effects.

Proceedings Article | 24 March 2017 Presentation + Paper

Layout independent leveling (LIL) on NXT:1980Di immersion scanners for enhanced productivity

Bram van Hoof, Arjan Holscher, Ralf Gommers, Jeroen Cottaar, Marcel Raas, Samah Khalek, Jan van Kemenade, Maarten Voncken, Roelof de Graaf, Elliot Oti, Stefan Weichselbaum, Richard Droste, ByeongSoo Lee, Chansam Chang, Young Seog Kang, Young Ha Kim, Jeong-Heung Kong, Jong Hoon Jang, YoungSun Nam, Hyunwoo Hwang

Proceedings Volume 10147, 101471A (2017) https://doi.org/10.1117/12.2259794

KEYWORDS: Semiconducting wafers, Sensors, Time metrology, Scanners, Optical alignment, Calibration, Wafer testing, Overlay metrology, Metrology, Computer programming

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Proceedings Article | 15 March 2016 Paper

Overcoming low-alignment signal contrast induced alignment failure by alignment signal enhancement

Byeong Soo Lee, Young Ha Kim, Hyunwoo Hwang, Jeongjin Lee, Jeong Heung Kong, Young Seog Kang, Bart Paarhuis, Haico Kok, Roelof de Graaf, Stefan Weichselbaum, Richard Droste, Christopher Mason, Igor Aarts, Wim de Boeij

Proceedings Volume 9780, 97800B (2016) https://doi.org/10.1117/12.2220587

KEYWORDS: Optical alignment, Signal processing, Overlay metrology, Optical lithography, Optics manufacturing, Opacity, Materials processing, Sensors, Wafer testing, Near infrared, Image processing

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Proceedings Article | 26 March 2015 Paper

Wafer to wafer overlay control algorithm implementation based on statistics

Byeong Soo Lee, Young Seog Kang, Jeong Heung Kong, Hyun Woo Hwang, Myeong Gyu Song

Proceedings Volume 9426, 942614 (2015) https://doi.org/10.1117/12.2086936

KEYWORDS: Semiconducting wafers, Logic, Reticles, Overlay metrology, Control systems, Statistical analysis, Process control, Electronics, Optical alignment, Optical lithography

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Proceedings Article | 6 April 2009 Paper

Performance improvement of IPMC using resonance frequency

Hyun-Woo Hwang, SungJoo Kim, Chul-Jin Kim, Hyunseok Yang, No Cheol Park, Young-Pil Park

Proceedings Volume 7287, 728726 (2009) https://doi.org/10.1117/12.815910

KEYWORDS: Metals, Actuators, Polymers, Composites, Resonance enhancement, Electroactive polymers, Molecules, Liquids, Optical amplifiers, Control systems

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Proceedings Article | 6 April 2009 Paper

Performance enhancement of IPMC by anisotropic plasma etching process

Seok Hwan Lee, Chul-Jin Kim, Hyun-Woo Hwang, Sung-Joo Kim, Hyun-Seok Yang, No-Cheol Park, Young-Pil Park, Kang-Ho Park, Hyung-Kun Lee, Nak-Jin Choi

Proceedings Volume 7287, 728722 (2009) https://doi.org/10.1117/12.815685

KEYWORDS: Plasma etching, Plasma, Platinum, Resistance, Actuators, Capacitance, Polymers, Composites, Process modeling, Optical lithography

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Proceedings Article | 10 April 2008 Paper

Preisach modeling of dielectric elastomer EAP actuator

HyunWoo Hwang, Chul-Jin Kim, Sung Joo Kim, Hyunseok Yang, No Cheol Park, Young-Pil Park

Proceedings Volume 6927, 692726 (2008) https://doi.org/10.1117/12.776629

KEYWORDS: Electroactive polymers, Dielectrics, Actuators, Polymers, Electrodes, Mathematical modeling, Data modeling, Shape memory alloys, Ferroelectric materials, Analytical research

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Proceedings Article | 10 April 2008 Paper

Preisach modeling of IPMC-EMIM actuator

Chul-Jin Kim, Hyun Woo Hwang, No-Cheol Park, Hyun-Seok Yang, Young-Pil Park, Kang-Ho Park, Hyung-Kun Lee, Nak-Jin Choi

Proceedings Volume 6927, 692725 (2008) https://doi.org/10.1117/12.776337

KEYWORDS: Actuators, Polymers, Smart materials, Shape memory alloys, Relays, Liquids, Mathematical modeling, Data modeling, Composites, Ferroelectric materials

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Showing 5 of 9 publications

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