Prof. Ingrid J. De Wolf Profile

Prof. Ingrid J. De Wolf

Group Leader at imec

SPIE Involvement:

Author

Publications (17)

SPIE Journal Paper | 18 March 2024 Open Access

Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic–electronic transceivers (Erratum)

David Coenen, Minkyu Kim, Herman Oprins, Yoojin Ban, Dimitrios Velenis, Joris Van Campenhout, Ingrid De Wolf

JOM, Vol. 4, Issue 01, 019801, (March 2024) https://doi.org/10.1117/12.10.1117/1.JOM.4.1.019801

KEYWORDS: Transceivers, Thermal modeling, Silicon photonics, Silicon, 3D modeling, Modulators, Optical microsystems, Microsystems, Engineering

Read Abstract +

DOWNLOAD PAPER

SPIE Journal Paper | 6 December 2023 Open Access

Thermal modeling of hybrid three-dimensional integrated, ring-based silicon photonic–electronic transceivers

David Coenen, Minkyu Kim, Herman Oprins, Yoojin Ban, Dimitrios Velenis, Joris Van Campenhout, Ingrid De Wolf

JOM, Vol. 4, Issue 01, 011004, (December 2023) https://doi.org/10.1117/12.10.1117/1.JOM.4.1.011004

KEYWORDS: Modulators, Crosstalk, Simulations, Photonic integrated circuits, Thermal modeling, 3D modeling, Thermal effects, Resistance, Design, Transceivers

Read Abstract +

DOWNLOAD PAPER

SPIE Journal Paper | 14 May 2012

Reliability test methodology for MEMS and MOEMS under electrical overstress and electrostatic discharge stress

Sandeep Sangameswaran, Jeroen De Coster, Guido Groeseneken, Ingrid De Wolf

JM3, Vol. 11, Issue 02, 021204, (May 2012) https://doi.org/10.1117/12.10.1117/1.JMM.11.2.021204

KEYWORDS: Microelectromechanical systems, Switches, Electrical breakdown, Actuators, Reliability, Dielectrics, Electrodes, Micromirrors, Laser Doppler velocimetry, Microopto electromechanical systems

Read Abstract +

Proceedings Article | 19 August 2010 Paper

Performance of a new type of module based on back-contact solar cells

Jonathan Govaerts, Jo Robbelein, Chun Gong, Bartek Pawlak, Mario Gonzalez, Ingrid De Wolf, Frederick Bossuyt, Steven Van Put, Ivan Gordon, Kris Baert, Jan Vanfleteren

Proceedings Volume 7773, 77730X (2010) https://doi.org/10.1117/12.859815

KEYWORDS: Silicon, Solar cells, Reliability, Glasses, Coating, Adhesives, Failure analysis, Crystals, Silicon solar cells, Laser drilling

Read Abstract +

Proceedings Article | 19 May 2009 Paper

New methods and instrumentation for functional, yield and reliability testing of MEMS on device, chip and wafer level

Ingrid De Wolf, Jeroen De Coster, Vladimir Cherman, Piotr Czarnecki, Stanislaw Kalicinski, Olalla Varela Pedreira, Sandeep Sangameswaran, Kris Vanstreels

Proceedings Volume 7362, 73620N (2009) https://doi.org/10.1117/12.820977

KEYWORDS: Microelectromechanical systems, Switches, Reliability, Semiconducting wafers, Resonators, Dielectrics, Resistance, Doppler effect, Micromirrors, Electrical breakdown

Read Abstract +

Proceedings Article | 3 October 2008 Paper

High throughput measurement techniques for wafer level yield inspection of MEMS devices

O. Varela Pedreira, T. Lauwagie, J. De Coster, L. Haspeslagh, A. Witvrouw, I. De Wolf

Proceedings Volume 7155, 71550M (2008) https://doi.org/10.1117/12.814724

KEYWORDS: Lithium, Inspection, Image segmentation, Semiconducting wafers, Microelectromechanical systems, Mirrors, Measurement devices, Image processing, Micromirrors, Microscopes

Read Abstract +

Proceedings Article | 3 October 2008 Paper

Long-term reliability measurements on MEMS using a laser-Doppler vibrometer

J. De Coster, L. Haspeslagh, A. Witvrouw, I. De Wolf

Proceedings Volume 7155, 71550G (2008) https://doi.org/10.1117/12.814515

KEYWORDS: Microelectromechanical systems, Laser Doppler velocimetry, Microscopes, Reliability, Cameras, Mirrors, Micromirrors, Optical testing, Data processing, Doppler effect

Read Abstract +

Proceedings Article | 15 February 2006 Paper

Laser joining of glass to silicon using adhesive for MEMS packaging applications

F. Bardin, S. Kloss, C. Wang, A. Moore, A. Jourdain, I. De Wolf, D. Hand

Proceedings Volume 6107, 610702 (2006) https://doi.org/10.1117/12.644741

KEYWORDS: Glasses, Silicon, Temperature metrology, Laser bonding, Semiconductor lasers, Polymers, Microelectromechanical systems, Absorption, Laser processing, Pyrometry

Read Abstract +

Proceedings Article | 22 January 2005 Paper

Characterization of (near) hermetic zero-level packages for MEMS

Piet De Moor, Kris Baert, Ingrid De Wolf, Anne Jourdain, Harrie Tilmans, Ann Witvrouw, Chris Van Hoof

Proceedings Volume 5716, (2005) https://doi.org/10.1117/12.596190

KEYWORDS: Microelectromechanical systems, Packaging, Sensors, Semiconducting wafers, Reliability, Resonators, Microbolometers, Liquids, Spectroscopy, Thin films

Read Abstract +

Proceedings Article | 30 March 2004 Paper

Numerical analysis of the process-induced stresses in silicon microstructures

Vincent Senez, Thomas Hoffmann, Aldo Armigliato, Ingrid De Wolf

Proceedings Volume 5274, (2004) https://doi.org/10.1117/12.524228

KEYWORDS: Silicon, Silicon films, Oxides, Temperature metrology, Raman spectroscopy, Calibration, Thin films, Crystals, Thermal modeling, Oxidation

Read Abstract +

Proceedings Article | 23 December 2003 Open Access

The reliability of RF-MEMS: failure modes, test procedures, and instrumentation

Ingrid De Wolf

Proceedings Volume 5343, (2003) https://doi.org/10.1117/12.532335

KEYWORDS: Switches, Reliability, Microelectromechanical systems, Bridges, Dielectrics, Switching, Capacitance, Packaging, Metals, Capillaries

Read Abstract +

DOWNLOAD PAPER

Proceedings Article | 2 October 2001 Paper

High-speed 3D optical imaging and failure analysis of high- and low-frequency movements in micro-electro-mechanical (MEMS) with nanometer resolution

W. Merlijn van Spengen, Ingrid De Wolf, Bob Puers

Proceedings Volume 4558, (2001) https://doi.org/10.1117/12.443001

KEYWORDS: Microelectromechanical systems, Resonators, 3D image processing, Failure analysis, Switches, CCD cameras, Optical imaging, Image resolution, Interferometry, Mirrors

Read Abstract +

Proceedings Article | 11 August 2000 Paper

Experimental one- and two-dimensional mechanical stress characterization of silicon microsystems using micro-Raman spectroscopy

W. Merlijn van Spengen, Ingrid De Wolf, Roy Knechtel

Proceedings Volume 4175, (2000) https://doi.org/10.1117/12.395600

KEYWORDS: Raman spectroscopy, Silicon, Sensors, Semiconducting wafers, Micro raman spectroscopy, Microelectromechanical systems, Phonons, Raman scattering, Light scattering, Crystals

Read Abstract +

Proceedings Article | 11 August 2000 Paper

Auto-adhesion model for MEMS surfaces taking into account the effect of surface roughness

W. Merlijn van Spengen, Ingrid De Wolf, Bob Puers

Proceedings Volume 4175, (2000) https://doi.org/10.1117/12.395617

KEYWORDS: Capillaries, Humidity, Microelectromechanical systems, Surface roughness, Information operations, Silicon, Data modeling, Interfaces, Osmium, Atomic force microscope

Read Abstract +

Proceedings Article | 10 August 2000 Paper

Micro nano technology visualization (MNTV) of micromachined MEMS polysilicon structures

Russell Lawton, Gisela Lin, Joanne Wellman, Leslie Phinney, Jose Uribe, Edward Griffith, Ingrid De Wolf, Eric Lawrence

Proceedings Volume 4180, (2000) https://doi.org/10.1117/12.395698

KEYWORDS: Microelectromechanical systems, Reliability, Visualization, Etching, Computer aided design, Data modeling, Oxides, Process modeling, Instrument modeling, Device simulation

Read Abstract +

Proceedings Article | 11 November 1999 Paper

High-resolution stress and temperature measurements in semiconductor devices using micro-Raman spectroscopy

Ingrid De Wolf, Jian Chen, Mahmoud Rasras, W. Merlijn van Spengen, Veerle Simons

Proceedings Volume 3897, (1999) https://doi.org/10.1117/12.369313

KEYWORDS: Raman spectroscopy, Silicon, Micro raman spectroscopy, Sensors, Temperature metrology, Semiconductors, Measurement devices, Crystals, Objectives, Plasma

Read Abstract +

Proceedings Article | 30 August 1999 Paper

Fabrication and reliability testing of Ti/TiN heaters

Piet De Moor, Ann Witvrouw, Veerle Simons, Ingrid De Wolf

Proceedings Volume 3874, (1999) https://doi.org/10.1117/12.361232

KEYWORDS: Resistance, Tin, Semiconducting wafers, Reliability, Temperature metrology, Microscopy, Resistors, Microelectromechanical systems, Sensors, Silicon

Read Abstract +

Showing 5 of 17 publications

View contact details

UPDATE YOUR PROFILE

Is this your profile? Update it now.

Sign into your SPIE.org account

Don’t have a profile and want one?

Create an account on SPIE.org

Keywords/Phrases

Search In:

Publication Years