A new method to measure the tensile adhesion of thin film was proposed. A single cantilever beam method was used and an efficient adjustable jig was designed to minimize errors induced by misalignment of specimen. Applied load and displacement were recorded by data acquisition system. The dimensions of the specimen and conditions of test were preexamined by finite element analysis. Developed method was applied to measure the adhesion of thin film adhesive. Test results were independent of initial deviation of specimen alignment and showed consistent value with respect to crack length. Compared with shear test method, it was shown that the shear adhesion included the effect of thickness of adhesive, however, tensile adhesion was independent of the thickness of adhesive.
Until now, it is known that stresses on the plane (y-z plane) perpendicular to the circumferential direction (x axis) of Oring
exist and stresses on the plane (x-y plane and x-z plane) parallel to the circumferential direction of O-ring does not
exist when O-ring is under uniform squeeze rate and internal pressure. But it was known that stresses of x-y plane and xz
plane of O-ring under uniform squeeze and internal pressure were existed by this research. To analyze 3 dimensional
stress distributions of O-ring under those loadings, stress distributions of every plane should be analyzed. Therefore,
photoelastic experimental hybrid method for 3 dimensional stress distributions of O-ring under uniform squeeze and
internal pressure were developed in this research. Photoelastic experimental procedures for 3 dimensional stress
distributions of O-ring under those loadings were introduced. Stress distributions of O-ring under those loadings were
analyzed by photoelastic experimental hybrid method developed in this research. Von Mises equivalent stresses at
arbitrary point of O-ring under those loadings were analyzed.
There are O-rings for movement and for airtight in O-rings. O-ring for movement is used to protect to penetrate the dust
or the alien substance into cylinder. O-ring for airtight is used to maintain airtight. Airtight of O-ring is controlled by
squeeze rate and the gap between external diameter of groove and internal diameter of cylinder. Squeeze rate of O-ring is
controlled by internal diameter of groove. Gap between external diameter of groove and internal diameter of cylinder is
controlled by the external diameter of groove. Stresses of O-ring are depended on the squeeze rate, gap and internal
pressure. O-ring for airtight is under uniform squeeze rate and internal pressure with constant gap. And then stress
distributions are very complicated. Therefore stresses of O-ring are almost analyzed by experiment.
To study the stress distributions of O-ring by experiment, 3-dimensional photoelastic experiment had better be used. To
study stress distributions of O-ring by 3-dimensional photoelastic experiment, loading device is very important. Loading
device should are functions, which uniform squeeze rate and internal pressure etc, can be applied, and the uniform
squeeze rate can be controlled.
Therefore, in this research, the loading device with functions explained above was developed. The validity of the loading
device was confirmed by the stress distributions of O-ring, the configuration change of O-ring and the contact length of
O-ring etc.. When squeeze rate is constant, the contact length of upper of the deformed O-ring is almost equal to that of
lower of the deformed O-ring. When the internal pressure is applied to O-ring under uniform squeeze rate, the contact
length of upper of O-ring is increased with the increment of the internal pressure by little. The contact length of lower of
O-ring is constant irrespective of the increment of the internal pressure.
Photoelastic model material with shape memory effect and molding processes of the material is developed in this research. Matrix and fiber of the photoelastic model material developed in this research are respectively epoxy resin and wire of Ti50Ni50 shape memory alloy. It is called Ti50Ni50 shape memory alloy fiber epoxy composite. It is assured that Ti50Ni50 SMA-FEC is satisfied with the requirements of photoelastic model material and can be used as photoelastic model material and can be used as photoelastic model material. The maximum recovering strain of Ti50Ni50 SMA-FEC is occurred at 80 degrees in any prestrain of Ti50Ni50 shape memory alloy wire fiber and in any fiber volume ratio. Recovering strain is increased with the increment of the prestrain and the fiber volume ratio.
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