The concurrent saturation in dimensional scaling and increase in manufacturing cost and complexity has caused the overall semiconductor manufacturing cost to significantly increase. As a result, the cost per transistor is predicted to sharply increase in future technologies, deviating from the typical 30% cost per transistor reduction. This work explores the use of 3D-integration technologies, as wafer-to-wafer hybrid bonding, for both mobile and high-performance application. It is observed that the use of 3D-integration schemes, can reduce the overall die cost at same functionality, paving the way for cost-effective scaling solutions in future technologies.
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