Heat sinks with impedance matching circuit have been designed and fabricated for the packaging of high-speed electroabsorption (EA) modulators. Ti/Cu/Ni/Au metallization system is adopted for the coplanar waveguide (CPW) electrodes and a 50-ohm Ta2N thin-film resistor in parallel with the EA modulator is used for impedance matching. By a matching resistance optimization, a reflection coefficient S11 better than -21 dB has been demonstrated up to 40 GHz. The heat sinks are applied successfully in the 40 GHz Modulator packaging.
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