A novel single-layer Rohm and Hass SPR220 lift-off processes with oxidation step in a double-cycle develop is introduced to offer promising lift-off profiles. First, the coated wafer uses a typical Pre-soak process before exposure to introduce an inhibition layer in the film. After exposure and PEB, a three-step (develop-oxidation-develop) develop process is used. Oxidation step is done by rinsing in DI water and drying the film after the first develop step prior to the second develop step. SEM cross-section inspection shows the wafers have gone through the oxidation step between the two develop cycles and present an ideal lift-off profile. This work has shown these profiles are not attainable without the oxidation step. The lift-off profile is repeatable as resist thickness changes between 2 - 6μm. The process also shows excellent process window capability and stability. It can be ideally used for thin-film deposition or a self-aligned one-mask etch/deposition application. We will also discuss and show process development for films at thickness’ of 1μm or less for smaller CD applications.
The detection of dominant points is an important problem in shape recognition. In this paper, the dominant point is divided into two kinds of point: corner point and tangent point, and a two stage method to detect the dominant point is proposed. The corner points are first detected based on the curvature smoothed by Gaussian filter, and tangent points are detected based on the curvature accumulation curve with the commonly used splitting method.
A new approach for vectorization of line drawings is proposed. In this paper, contour vectorization is first applied to convert the scanned image of drawings from raster form to vector form. After the operation of contour matching, elements of skeletal vector and sub- shape are obtained. On the basis of the two types of elements, a graph G(V,E) is built up to help analyze the forked joint in line drawings, and the method of curve tracing and splitting is also discussed to fulfill the sub-optimal extraction of line and arc segments. In addition, experimental results are given showing better results than that of the traditional thinning approach.
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