We present spatiotemporal denoising based on overlapped motion compensation and advanced collaborative filtering. First, noise-robust overlapped motion compensation is performed on a block basis for temporal grouping. Next, the K-nearest neighbors of each block are grouped in a 3D array, and the 3D array is transformed. Then, adaptive soft thresholding is performed in the 3D transform domain. In addition, a modified weighting strategy for aggregation is applied for better visual quality. Simulation results show that the proposed algorithm improves the peak signal-to-noise ratio performance by about 2 dB in comparison with the state-of-the-art technique while providing much better subjective visual quality.
We present a review of our work on the micro/nano-scale design, fabrication and integration of optical waveguide arrays and devices for applications in a newly-conceived optical module system that we call "optical printed circuit board" (O-PCBs) and VLSI micro/nano-photonic integrated circuit. The O-PCBs consist of planar circuits and arrays of waveguides and devices of various dimensions and characteristics to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards. The VLSI micro/nano-photonic integrated circuits perform similar functions on a chip scale. O-PCBs consist of planar circuits and arrays of waveguides and devices of various dimensions and characteristics to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards. Fundamentally it contrasts with the electrical printed circuit board (E-PCB), which is designed to perform transporting, processing and distributing electrical signals. We have assembled O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined information handling performances when they are interconnected with the micro-laser arrays, detector arrays and optoelectronic devices. For VLSI nano-scale photonic inte-gration and applications, we designed power splitters and waveguide filters using photonic band-gap crystals and plasmonic waveguide structures. We discuss scientific issues and technological issues concerning the minia-turization, interconnection, and integration of micro/nano-photonic devices and circuits and discuss potential utilities of O-PCBs and VLSI micro/nano-photonics for applications in computers, telecommunication systems, transportation systems, and bio-sensing microsystems.
We report on the design, fabrication and integration of micro/nano-scale optical wire circuit arrays and devices for high-speed, compact, light-weight, low power optical printed circuit boards (O-PCBs) and VLSI photonic applications. The optical wires are formed in the form of waveguides by thermal embossing and ultraviolet (UV) radiated embossing of polymer materials. The photonic devices include vertically coupled surface emitting laser (VCSEL) microlasers, microlenses, 45-degree reflection couplers, directional couplers, arrayed waveguide grating structures, multimode interference (MMI) devices and photodetectors. These devices are optically interconnected and integrated for O-PCB assembly and VLSI micro/nano-photonics. The O-PCBs are to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We report on the result of the optical transmission performances of these assembled O-PCBs. For the design, fabrication, and VLSI integration of nano-scale photonic devices, we used photonic crystal structures and plasmonic metallic waveguide structures. We examined the bandwidth, power dissipation, thermal stability, weight, and the miniaturization and density of optical wires and the O-PCB module. Characteristics of these devices are also described.
We report on the recent progresses of our work on the design, fabrication and integration of micro/nano-scale photonic devices and optical waveguide arrays for optical printed circuit boards (O-PCBs) and VLSI photonic applications. The waveguides are designed and fabricated by thermal embossing and ultraviolet (UV) radiated embossing of polymer materials. The photonic devices include vertically coupled surface emitting laser (VCSEL) microlasers, microlenses, 45-degree reflection couplers, directional couplers, arrayed waveguide grating structures, multimode interference (MMI) devices and photodetectors in micro/nano-scale. These de-vices are optically interconnected and integrated for O-PCB assembly and VLSI micro/nano-photonics. De-tailed procedures of fabricating and implementing these devices and assembly of O-PCB are described. The O-PCBs are to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We report on the result of the optical transmission performances of these as-sembled O-PCBs up to 2.5 Gbps and 10 Gbps. For the design, fabrication, and VLSI integration of nano-scale photonic devices, we used photonic crystal structures. Characteristics of these devices are also described.
We report on the results of our study on the design, fabrication and integration of micro/nano-scale waveguide arrays and devices for applications for a modular system that we newly proposed and call "optical printed circuit board (O-PCB)," which we envision to use as a platform for VLSI micro/nano-photonic applications. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We have designed and assembled O-PCBs using polymer-based optical waveguide arrays and circuits. We describe the procedures for the synthesis of polymers, procedures of forming masters and stamps, and procedures of forming waveguides using embossing techniques. We also describe the procedures of design, fabrication and construction of O-PCBs and describe the procedures for light coupling between light sources, detectors, waveguides and other functional devices. We also describe design of power beam splitters and waveguide filters using photonic band-gap crystals for VLSI photonic integration application. We also discuss the characteristics of the assembled O-PCBs and discuss their potential applications.
We report, in the form of review, on the results of our study on the fabrication and assembly of polymer-based optical waveguide arrays and micro/nano-photonic devices for optical printed circuit boards (O-PCBs) application. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards, substrates or chips. We have assembled and constructed O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined their information handling performances. We also designed power beam splitters and waveguide filters using nano-scale photonic band-gap crystals. We discuss scientific and technological issues concerning the processes of miniaturization, interconnection and integration of polymer optical waveguide devices and arrays for the O-PCBs as applicable to board-to-board, chip-to-chip, and intra-chip integration for computers, telecommunications, and transportation systems.
We report on the results of our study on the micro/nano-scale design, fabrication and integration of waveguide arrays for optical printed circuit boards (O-PCBs) and VLSI micro/nano-photonic applications. The O-PCBs are designed to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We have assembled O-PCBs using optical waveguide arrays and circuits made of polymer materials and have examined information handling performances. We also designed power beam splitters and waveguide filters, using nano-scale photonic band-gap crystals, for VLSI photonic integration application. We discuss potential applications of polymer optical waveguide devices and arrays for O-PCB and VLSI micro/nano-photonics for computers, telecommunications, and transportation systems.
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