In the European TINKER project, which pushes the development of LiDAR (Light Detection And Ranging) technology, NIL has been explored with the aim of improving manufacturing of the optical structures. More specifically, the main idea is to use NIL to manufacture the waveguide structures of the PIC chips for LiDAR. With this objective, the four partners closely involved in NIL: CEA-Leti, PROFACTOR, EV Group and Inkron, pooled their expertise and demonstrate the high potential of this technique.

This study led to the development of a new imprintable material with a high refractive index. Moreover, specific designs linked to the application and investigating the NIL physicals phenomenon were manufactured. The combination of both, material and design allowed to prove the capability to manufacture waveguide with NIL using the specified index material. The study was completed with optical functional tests. Furthermore, global manufacturing approach was studied and demonstrating the sustainability of NIL manufacturing and its ability to reduce manufacturing time and cost.

Since its beginning in the 90’s NanoImprint Lithography (NIL) has been continuously improved to target the different industry requirements. Using an intermediate soft stamp media was one of the main improvements and has now become a standard technology. Based on that technology, EVG introduces a full wafer imprinting solution, whereas the size of the stamp corresponds to the size of the wafer to imprint. Results obtained at CEA-Leti using this solution, with respect to uniformity, sub-50nm resolution, repeatability, and high aspect ratio patterns, are today state of the art and allow NIL to be considered as an HVM technology. Nevertheless, further development is carried out on different aspects such as overlay (OVL) which is the scope of this work.