Mr. Li Ming Tu Profile

Li Ming Tu

at Yangtze Memory Technologies Co Ltd

SPIE Involvement:

Author

Publications (4)

Proceedings Article | 22 February 2021 Poster + Presentation + Paper

A novel method of overlay variation study for 3D NAND channel hole

Leeming Tu, Haydn Zhou, Erik Xiao, Jin Zhu, Cynthia Li, Ningqi Zhu, Xin Li, Jason Pei, Miao Bing, Seddy Chu, Kevin Huang, Bob Dong

Proceedings Volume 11611, 116112W (2021) https://doi.org/10.1117/12.2583760

KEYWORDS: Etching, Statistical analysis, Semiconducting wafers, Overlay metrology, Process control, Photomasks, Optical alignment, Opacity, Metrology, Feedback control

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Proceedings Article | 20 March 2020 Presentation + Paper

3D-NAND wafer process monitoring using high voltage SEM with auto e-beam tilt technology

Leeming Tu, Jian Mi, Henry Fan, Haydn Zhou, Felix Xiong, Louis Tu, Gangyi Chen, Chuanyu Shao, Long Zhang, Shinji Kubo

Proceedings Volume 11325, 113250L (2020) https://doi.org/10.1117/12.2551610

KEYWORDS: Semiconducting wafers, Critical dimension metrology, Scanning electron microscopy, Overlay metrology, Sensors, Signal detection, 3D metrology, Etching, Electron beams, Electron microscopes

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Proceedings Article | 20 March 2020 Presentation + Paper

Machine learning and hybrid metrology using HV-SEM and optical methods to monitor channel hole tilting in-line for 3D NAND wafer production

Michael Meng, Leeming Tu, Jian Mi, Haydn Zhou, Xi Zou

Proceedings Volume 11325, 113250O (2020) https://doi.org/10.1117/12.2551622

KEYWORDS: Semiconducting wafers, Machine learning, Wafer-level optics, 3D metrology, Metrology, Channel projecting optics, Optical metrology, Principal component analysis, Scanning electron microscopy, Etching

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Proceedings Article | 13 March 2018 Paper

A new way of measuring wiggling pattern in SADP for 3D NAND technology

Jian Mi, Ziqi Chen, Li Ming Tu, Xiaoming Mao, Gong Cai Liu, Hiroki Kawada

Proceedings Volume 10585, 105852S (2018) https://doi.org/10.1117/12.2297249

KEYWORDS: Double patterning technology, Metrology, Optical inspection, Scanning electron microscopy, Image compression, Visualization, Inspection, Semiconducting wafers, Image visualization, Image enhancement

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