A series of on-chip optical links of 50-μm length, utilizing 650 to 850 nm propagation wavelength, with Si avalanche-mode optical sources, silicon nitride-based waveguides, and Si Ge detectors, have been designed and realized, with a 0.35-μm SiGe radio frequency bipolar integrated circuit process. The optical coupling between the optical source and the detectors was realized by a set of dedicated designed optical waveguides, which were all fabricated with components of the SiGe radio frequency process. All components were fully integrated on the same silicon chip. The Si avalanche-mode light-emitting diodes (Si AMLEDs) emitted in the 650- to 850-nm wavelength regime. Correspondingly, small microdimensioned detectors utilize SiGe detector technology with detection efficiencies of up to 0.85 in the same wavelength regime and with a transition frequency of up to 20 GHz. Best performances for the optical links as realized show optical coupling of up to 5 GHz with a total optical link budget loss of −40 dB. A set of link results are presented and several interpretations are given on current realizations. The technology is particularly suitable for realization of low-cost on-chip optical signal processing, optical interconnects, and various types of on-chip microsensors.
Light emission in silicon LEDs that operate in the avalanche mode of operation, was analyzed by appropriate modelling, including the silicon energy band structure, available carrier energy spread, and available carrier momentum spread. These mechanisms play key roles in the realization of light emitting, using standard silicon processing procedures. The analyses indicate that appropriate doping and controlling the energized specifically electrons, carrier energy and carrier density by field manipulation, and controlling carrier momentum through appropriate impurity scattering technology, show great potential to enhance these emissions. Particularly, development work conducted on the p+np+ mono-silicon LED and the N+PN+PN+ Poly silicon LED show that field control, impurity and defect scattering and balancing the carrier type and carrier density has a profound influence on the optical emission intensity in Si AMLEDs. Furthermore, a much clearer understanding of the mechanisms responsible for optical emissions in Si Av LEDs has been obtained and can proceed with further improved device designs and applications.
A two junction micro p+-np+ Silicon Avalanche based Light Emitting Device (Si AM LED) structure was analyzed in terms of dispersion emission characteristics, resulting in different wavelengths of light (colors) being emitted at different angles from the structure. Si AM LEDs can be integrated in on-chip bipolar RF integrated circuitry at micron and even submicron dimensions and have furthermore modulation frequencies into the GHz rang. As a first analyses, the optical propagation mechanisms were modelled by developing a custom designed EXCEL Progressive Ray Tracing Design Tool. (EPRTDT), whereby the positioning of the optical source, the initial launch direction of a particular optical wave fronts, and the subsequent refraction of planar ray fronts into subsequent layers of different refractive indices, in the structure could be progressively modelled. Subsequently, more exact simulations could be obtained by using an existing advanced simulation tool, RSOFT, as is generally available on the free market. The specific approach enabled the design of basic optical microstructures in a silicon 0.35 micron RF bipolar process, determining the dispersion behavior of propagation at different wavelengths, coupling of radiation into adjacently lying waveguides, determining propagation behavior into different type of waveguides, studying interaction with secondary regions of different refractive index, as well as design specific structures that could propagate radiation vertically out of the micro-structures into free space. The analyses have important applications for the realization of wavelength dispersers, couplers of SiAMLEDs into waveguides, realization of optical link structures on silicon chip, as well as micro vertical emitters of radiation out of the chip.
KEYWORDS: Copper, Solar energy, Patents, Switches, Temperature metrology, Solar cells, Solar energy systems, Relays, Control systems, Intellectual property
A low-cost heat exchanger system was developed that enable the realization of high pressure, low pressure isolated solar water heating systems in Africa. Africa countries are mostly located mid equatorial and has superfluous resources of solar and thermal energy. The design comprised of a copper coil based heat exchange system that can replace the normal heating element and thermostat in a conventional household geyser. The circulation in the system is performed by a small separate photovoltaic panel and circulation pump. The exchanger allows for isolation of the high pressure and low pressure sections of a normal household geyser system and enable the utilization of very large, low cost solar heat absorber platforms. This feature remarkably increasing the heat collection capacity of the system. An integrated switch allows the system to alternate between conventional electrical heating and solar water heating, according to prevailing weather conditions. A smart sensor system monitor absorber and ambient temperatures continuously, and controls switch on times and circulation rates according to prevailing weather conditions, and in order to optimize thermal energy collection. The system can be installed at approximately 10 000 -12 000 SA Rand. Calculations show that the system can provide hot water to a household in South Africa at approximately 0. 12 SA rand per kWh, implying a saving to current customer that uses grid electricity at approximately R600 per month (weather depending). The accumulated saving to the household owner is of the order of 200 000 SA Rand over a ten year lifetime period for the product. The system offers numerous new business opportunities and job creation opportunities in South Africa. It is believed that the technology can be supplied and products can be provided to other international countries outside of South Africa. In this case the international countries can draw advantage from the technology as developed in South Africa, and can import products at reduced (very low costs ) drawing on the advantageous of an extreme favorable exchange rates, reduced import levies, while providing dire job opportunities in an developing African countries.
A novel silicon SiGe edge light emitting diode (SiGe ELED) was realized in standard RF bipolar SiGe technology process that uses a p-n junction either in reverse and forward bias mode configurations. A vertical cubical columnar SiGe/Si HBT like structure was used. The light emitting process in the reverse bias mode is by means of an avalanche breakdown process. The reverse biased device emits light in the wavelength range of 450–650 nm, with operating voltage and current of 1.3 V and 8 mA respectively, while the forward biased mode emitted at about 850nm. In the forward biased mode, it operates in a two junction mode with the first n+p junction emitting low energy electrons into a lowly doped p region. The SiGe ELED is intended to be implemented in an optical interconnect with an external detector via a lateral optical waveguide coupling. Because the LED emit in a broad spectrum, localizing the emission source point is of paramount importance. Two techniques were used to attempt to realise this objective. Optical Probe measurement and Optical Power Meter Mapping technique. Localization of the emission source point process was performed through scanning a lensed fiber coupled to an optical power meter, over the edge surface profile of the diced device. The side edge of the diced device structure was interface with the lens fibre in other to ascertain the maximum emission point and the nature of light emitting process. This was done using a smooth dicing of the LED device close to its emitting edge and scanning its edge surface through a multimode lensed fiber coupled to an optical power meter. The mapping area scanned was 40μm x 40μm and 60μ x 60μ to localize the emitting source point region. A total emitted optical power as measured from the Led was 2.86nW as measured by the optical power meter connected to the lensed optical fibre. This was confirmed with a light-current-voltage (LIV) characteristics power measurement curve obtained from the device by means of the edge mapping techniques. A rough estimated localization of the source point was approximately 0.3mW optical power with a current of 8mA was realized with this technique. These results can be used to design accurate electro-optical conversions in integrated photonic circuitry as well as designing well coupled optical interconnects from the chip to the environment.
Si LEDs that operate in the reverse avalanche mode (Si AM LED) and forward bias (Si FB LED), offer various possibilities for realizing nano and micro biosensors directly on chip. The LEDs operate in 450 - 1100nm wavelength range, can emit up to 100nW of optical power, and can be fabricated in micro and nano dimensions. The dispersion characteristics has been studied for a Si AM LED source that is positioned one micron below silicon surface. Subsequently, a fluidic channel sensor device has been designed using the dispersion characteristics. Hence transmittance and absorption spectra studies of species that flow in a fluidic channel can be studied. Similarly, a waveguide-based sensor device has been designed where a receptor layer is fabricated on a waveguide on chip between a Si AM LED and a Si p-i-n detector. The receptor layer binds preferentially with a defined pathogen, and couples with the evanescent radiation of the waveguide.
A two-junction micro p+np+ silicon avalanche-mode light-emitting device (Si AMLED) is analyzed for its dispersion characteristics, which generally resulted in different wavelengths of light (colors) being emitted at different angles from the surface of the device. The SiAMLED is integrated into on-chip bipolar radio frequency-integrated circuitry at micron dimensions. LEDs have high-frequency modulation frequencies reaching into the GHz range. Such devices, which are of micron dimension, operate at 8 to 10 V, 1 μA to 2 mA. The emission wavelength is in the 450- to 850-nm range, emission spot sizes are about 1 μm2, and emission intensities are up to 200 nW . μm − 2. The observed geometrical-chromatic dispersion characteristics range from 0.01 deg / nm wavelength for green radiation at a 5 deg exit angle to the normal of the device to 0.16 deg / nm wavelength for blue radiation at a 60 deg exit angle to the normal of the surface of the device. The high dispersion characteristics of the emitted radiation are attributed to the positioning of the optical source ∼1 μm subsurface to the silicon–silicon oxide interface, as well as to the high-refractive index differences between silicon and the surrounding lower refractive index silicon oxide layers. It is believed that the identified dispersion characteristics will have interesting and futuristic on-chip electro-optic applications for on-chip micro-optical wavelength dispersers, futuristic optical communication demultiplexers, along with on-chip microgas and biosensor applications.
Si Av LEDs are easily integrated in on-chip integrated circuitry. They have high modulation frequencies into the GHz range and can be fabricated to sub-micron dimensions. Due to subsurface light generation in the silicon device itself, and the high refractive index differences between silicon and the device environment, the exiting light radiation has interesting dispersion characteristics. Three junction micro p+-np+ Silicon Avalanche based Light Emitting Devices (Si Av LEDs) have been analyzed in terms of dispersion characteristics, generally resulting in different wavelengths of light (colors) being emitted at different angles and solid angles from the surfaces of these devices. The emission wavelength is in the 450 - 850 nm range. The devices are of micron dimension and operate at 8 - 10V, 1μA - 2mA. The emission spot sizes are about 1 micron square. Emission intensities are up to 500 nW.μm-2. The observed dispersion characteristics range from 0.05 degrees per nm per degree at emission angle of 5 degrees, to 0.15 degrees per nm at emission angles of 30 degrees. It is believed that the dispersion characteristics can find interesting and futuristic on-chip electro-optic applications involving particularly a ranging from on chip micro optical wavelength dispersers, communication de-multiplexers, and novel bio-sensor applications. All of these could penetrate into the nanoscale dimensions.
Optical emission probabilities from silicon were analyzed by appropriate modelling, taking the silicon energy band structure, available carrier energy spread, and available carrier momentum spreads that can be realized with typical device design and operating conditions as available in current silicon technologies. The analyses showed that creation of micron-dimensioned conduction channels as made possible by using a RF bipolar fabrication process, appropriate doping and variations in the channel utilizing Boron, Phosphorous and Germanium doping, and using reversed biased junctions to energize specifically electrons, appropriately controlling carrier energy and carrier density, and control over carrier momentum through appropriate impurity scattering technology; particularly, 280nm, 650nm and 850nm emissions can be stimulated. Particularly, using p+nn and p+np+ device designs with appropriate control over carrier energy, carrier type balancing and implementing enhanced impurity scattering in some device regions, show the greatest potential to enhance these emissions. First iteration empirically conducted device realizations results show interesting peaking features and nonuniform high intensity behaviors. Particularly, it was succeeded to increase the emissions at 650nm with about two orders of magnitude. Internal electrical- to- optical conversion efficiencies of up to 10-4 and intensity emissions of up to 200 nW μm2 are derived, with further prospects to increase emissions further. The attained results compare extremely favorable, and in some cases exceeds, results as published by Venter et al, Kuindersma et al and Du Plessis et al using related technologies.
Silicon Photonics is an emerging field of research and technology, where nano-silicon can play a fundamental role. Visible light emitted from reverse-biased p-n junctions at highly localized regions, where avalanche breakdown occurs, can be used to realize a visible electro-optical sources in silicon by means of light-emitting diodes (Si-LEDs) is reviewed by characterizing the spectral distribution. Regarding applications, a monolithic optoelectronic integrated circuit (OEIC) for on-chip optical interconnection based on standard CMOS technology is discussed. Although there are some of the present challenges with regard to the realization of suitable electro-optical elements for diverse integrated circuit applications, the type of silicon light source can be further developed into be a Si-based optical short-distance on-chip optical interconnect applications.
Si Avalanche based LEDs technology has been developed in the 650 -850nm wavelength regime [1, 2]. Correspondingly, small micro-dimensioned detectors with pW/μm2 sensitivity have been developed for the same wavelength range utilizing Si-Ge detector technology with detection efficiencies of up to 0.85, and with a transition frequencies of up to 80 GHz [3] A series of on-chip optical links of 50 micron length, utilizing 650 – 850 nm propagation wavelength have been designed and realized, utilizing a Si Ge radio frequency bipolar process. Micron dimensioned optical sources, waveguides and detectors were all integrated on the same chip to form a complete optical link on-chip. Avalanche based Si LEDs (Si Av LEDs), Schottky contacting, TEOS densification strategies, silicon nitride based waveguides, and state of the art Si-Ge bipolar detector technologies were used as key design strategies. Best performances show optical coupling from source to detector of up to 10GHz and - 40dBm total optical link budget loss with a potential transition frequency coupling of up to 40GHz utilizing Si Ge based LEDs. The technology is particularly suitable for application as on-chip optical links, optical MEMS and MOEMS, as well as for optical interconnects utilizing low loss, side surface, waveguide- to-optical fiber coupling. Most particularly is one of our designed waveguide which have a good core axis alignment with the optical source and yield 10GHz -30dB on-chip micro-optical links as shown in Fig 9 (c). The technology as developed has been appropriately IP protected.
Graded junction, carrier energy and momentum engineering concepts have been utilized to realize a high intensity 100 nW 5GHz Silicon Avalanche based LED (Si Av LED). A silicon 0.35 micron RF bi-polar process was used as design and processing technology. Particularly, the carrier momentum and energy distributions were modeled in graded junction Silicon p+-i-n structures, and utilized to increase optical yield. Best performance are up to 750nW emission in a 7 micron square active area at 10 V and 1mA. The device show up to 5 GHz modulation bandwidth. The spectral range is from 450 nm to 850 nm with an emphasized components in the white spectral region. The process is greatly CMOS compatible. The technology is particularly suitable for application in futuristic on- chip micro-photonic systems, lab-on chip systems, silicon- based micro display systems, on chip optical links, and optical inter-connects systems.
Micron dimensioned on-chip optical links of 50 micron length, utilizing 650 – 850 nm propagation wavelength, have been realized in a Si Ge bipolar process. Key design strategies is the utilization of high speed avalanche based Si light emitting devices (Si Av LEds) in combination with silicon nitride based wave guides and high speeds Si Ge based optical detectors. The optical source, waveguide and detector were all integrated on the same chip. TEOS densification strategies and state of the art Si-Ge bipolar technology were further used as key design strategies. Best performances show up to 25 GHz RF carrier modulation and - 40dBm total optical link budget loss with a power consumption of only 0.1 mW per GHz bandwidth. Improvement possibilities still exist. The process used is in regular production. The technology is particularly suitable for application as optical interconnects utilizing low loss, side surface, waveguide to optical fibre coupling.
This paper analyzes the optical propagation and refraction phenomena in various complementary metal–oxide–semiconductor (CMOS) structures at 750 nm wavelength. Operation at these wavelengths offers the potential realizations of small microphotonic systems and micro-opto-electro-mechanical systems (MOEMS) in CMOS integrated circuitry, since Si-based optical sources, waveguides, and silicon (Si) detectors can all be integrated on a single chip. It could also increase the optical coupling efficiencies to external optical fibers. With the help of Monte Carlo and RSoft BeamPROP simulations, we demonstrate achievements with regard to optimizing vertical emission, focusing, refraction, splitting and wave guiding in 0.35 to 1.2 μm CMOS technology at 750 nm wavelength. The material properties, refractive indices, and thicknesses of various CMOS over-layers were incorporated in the simulations and analyses. The analyses show that both Si nitride and Si oxi-nitride offer good viability for developing such waveguides. Effective single-mode wave-guiding with calculated loss characteristics of 0.65 dB⋅cm −1 , with modal dispersion characteristics of less than 0.2 ps⋅cm −1 and with a bandwidth-length product of higher than 100 GHz-cm seems possible. A first iteration realization of an optical link is demonstrated, utilizing specially designed avalanche-based Si-LEDs and a specially designed first iteration CMOS waveguide. Potential applications of avalanche-based Si LEDs into microphotonic systems and MOEMS are furthermore proposed and highlighted.
Advanced 3D CAD and optical simulation software were used to design first
iteration on-CMOS chip MOEMS micro-systems. A Si Avalanche-based LED
and an array of detectors interface laterally with a single arm canti-lever system,
all to be fabricated with CMOS technology. Silicon nitride wave-guides are
used as optical propagation channels offering losses of lower than 1dB.cm-1.
Micro-bending and multi-planing of the wave guiding is possible. Far-field
manipulation of the emitted channel radiation is possible. Mechanically
designed and sensor systems can be added by means of CMOS post processing
techniques. The emission level of the Si CMOS Av LEDs is 10+3 higher than
the detectivity of silicon p-i-n detectors, offering good dynamic range in
detection and data analyses. The mature processing characteristics of CMOS
technology offers high integration possibilities and low cost manufacturing of the
designed systems.
The utilization of Organic Light Emitting Diodes (OLEDs) and Si Avalanche LEDs emitting at 0.45 - 0.75
micron enable the development of high speed all -Silicon CMOS based optical communication systems without the
incorporation of materials such as Ge or III-V components. The development of low loss and high curvature optical
waveguides in CMOS technology at these wavelengths, however, offers major challenges. Advanced optical
simulation software was hence used in order to develop effective CMOS based waveguides, using CMOS materials
characteristics, processing parameters, and the spectral characteristics of CMOS Av LEDs. The analyses show
that both silicon nitride and Si oxi-nitride offer good viability for developing such waveguides, utilizing 0.2 to
1.5 micron wide CMOS over-layer as well as trench-based technology. Particularly, trench based technology are very
attractive, since the optical sources can then be integrated with silicon avalanche based LEDs with trench-based
waveguides on the same plane with standard CMOS processing procedures. Effective single mode wave-guiding
with calculated loss characteristics of 0.65 dB.cm-1 and modal dispersion characteristics of 0.2 ps.cm-1 and
with a bandwidth-length product of higher than 100 GHz-cm are predicted.
Emission levels in the 450-750nm range of about 80-100 fold higher than that emitted by single junction
avalanche LEDs, has been obtained. CMOS Si LED p+-i-np+ structures were modeled in order to investigate the
effect of various depletion layer profiles and defect engineering on the photonic transitions in the 1.4 to 2.8 eV, 450-750nnm regime. Modeling and device simulation results showed that by utilizing a short lowly doped layer in
between a highly doped p+ layer and n layer can enhance the photonic yields by orders of magnitude through an
increase in the dynamic carrier densities in the device and favoring enhanced lateral multiplication processes. The
electric field profile should be of the order of 5 x 105 V.cm-1 and about 0.5 micron long. Injecting of carriers of
opposite charge type from an opposing forward bias junction further enhance the photonic yield. These models and
interpretations is confirmed by analyses of device designs as realized in 1.2 μm and 0.35 CMOS technology.
The device design involved normal CMOS design and processing procedures with no excessive micro-dimensioning.
The current devices operated in the 8-10V, 1uA - 2mA regime and yield emission intensities of up to 100 nW.μm-2.
The current emission levels are about three orders higher than the low frequency detectability limit of Si CMOS p-n
detectors of corresponding area. The particular design favors higher emission levels towards the 750nm wavelength
region. This makes diverse electro-optical applications possible such as optical communication on chip, diverse
optical signal processing and wave-guiding. It also enables realization of on chip Micro-Optical-Electro-Mechanical
Sensors (MOEMS), which could lead to the development of so-called "smart chips" utilizing standard CMOS
integrated circuitry.
This paper discusses the simulation, development and potential application of Si LEDs in pre-specified
complementary metal oxide semiconductors (CMOS) integrated circuit structures in the wavelength range of 450nm -
750nm. A MONTE CARLO simulation technique was developed in which the optical wave propagation phenomena as
relevant in CMOS structures were continuously updated as the optical ray progresses through the structure.
Refractive index of the material, layers thickness and structure curvatures were all incorporated as ray propagation
parameters. By using a multi-ray simulation approach, the overall propagation phenomena wrt refraction, reflection,
scattering, and intensities could be evaluated in globular context in any complex CMOS integrated circuit structure
in a progressive way. MATLAB software was used as a mathematical capable and programmable language to develop
the dedicated software evaluation tool. Subsequently, some first iteration, conceptual, applications of MOEMS
structures are demonstrated as implemented in Si CMOS integrated circuitry, utilizing Si InAva LEDs and silicon detectors.
Modeling of p+np+ CMOS Si LED structures show that by utilizing a short linear increasing E-field in the p+n reverse biased junction with a gradient of approximately 5 × 105 V.cm-1. μm-1, and facing an injecting p+n junction, has the potential to enhance photonic emissions in the 2.2 and 2.8 eV (450-750nm ) regime. Latest new designs utilize reach-through techniques in p+np+ avalanche-injection control structures and p+np+ poly-Si gated structures and show positive realizations of this model. Areas in the devices show marked increases in emission efficiency of factors of up to 50 - 100 as compared to previous realizations utilizing no reach-through and injection techniques. The current devices operated in the 6-8V, 1uA - 2mA regime and emit at levels of up to ~10nW /μm2.
The developed devices have been realized using standard 0.35 μm CMOS design rules and fabrication technology, and have particular technological significance for future all-silicon CMOS opto-elctronic circuits and systems. The current emission levels are about three orders higher than the low frequency detectability limit of CMOS p-i-n
detectors of corresponding area.
We report on an increase in emission intensity of up to 10 nW / microns2 that has been realized with a new novel two
junction, diagonal avalanche control and minority carrier injection silicon CMOS light emitting device. The device
utilizes a four terminal configuration with two shallow n+p junctions, embedded in a p substrate. One junction is kept in deep avalanche and light emitting mode, while the other junction is forward biased and minority carrier electrons are
injected into the avalanching junction. The device has been realized using standard 0.35 micron CMOS design rules and
fabrication technology and operates at 9V in the current range 0.1 - 3mA. The optical emission intensity is anout
two orders higher than that for previous single junction n+ p light emitting junctions. The optical output is about three orders higher than the low frequency detectivity limit of silicon p-i-n detectors of comparable dimensions. The realized
characteristics may enable diverse opto-electronic applications in standard CMOS silicon technology based integrated
circuitry.
In this paper we report on the dependency of quantum efficiency of an avalanching light emitting junction on current density and on the injection current from an adjacent lying forward biased junction. In particular, we report on the interpretation of results and modelling of the physical processes responsible for the light emission. The phenomenon was observed in a three terminal silicon bipolar junction CMOS light emitting device (Si BJ CMOS LED). Our observations show that the overall quantum efficiency and light emission from these type of devices can be improved to the 10-3 regime. The optical emissions is about four orders higher than the low frequency detectivity for silicon CMOS detectors of comparable dimension. The three terminal device also enable modulation of the light emission by a third terminal contact. The device has the potential of being fully integratable with standard CMOS integrated circuitry with no adaptation to the CMOS design and processing procedures.
A prototype Silicon CMOS Optical Integrated Circuit (Si CMOS OEIC) was designed and simulated using standard 0.8 micron Bi-CMOS silicon integrated circuit technology. The circuit consisted of an integrated silicon light emitting source, an optical wave-guiding structure, two integrated optical detectors and two high-gain CMOS transimpedance analogue amplifiers. Simulations with MicroSim PSpice software predict a utilizable bandwidth capability of up to 220 MHz for the trans-impedance amplifier for detected photo-currents at the input of the amplifier in the range of 1 nA to 100 nA and driving a 10mV to 1 V signal into a 100 kΩ load. First iteration OEIC structures were realised in 1.2 micron CMOS technology for various source-waveguide-detector arrangements. Current signal ranging from 1nA to 1 micro-amp was detected at detectors. The technology seems favorable for first-iteration implementation for digital communications on chip up to 200Mbps.
number of planar silicon light-emitting devices are designed
and realized in standard 1.2 and 2-mm complementary metal oxide semiconductor
(CMOS) integrated circuitry. The devices yield optical power
intensities of up to 0.2 mW/cm2 (up to 0.2 nW per 100 mm2) at operating
voltages from 4 to 31 V and at currents of 0.1 to 10 mA, respectively. The
devices emit light in a broad spectrum from 450 to 800 nm with characteristic
peaks at 500 and 650 nm. The emitted intensity of the devices is
three to four orders of magnitude higher than the low-frequency detectability
limit of integrated Si optical pn detectors utilizing similar areas on
chip as the light sources. Initial investigations indicate that the devices
have a very fast inherent modulation bandwidth capability. The devices
show potential for on-chip electro-optical communication and chip-tochip
electro-optical communications.
We have recently observed an increase in the visible electroluminescence from a two-junction Si n+pn CMOS structure. The device emit visible light in the 450 - 750 nm wavelength region at intensities up to 1 nWmicrometers -2 and operate at 8 - 20V and 50 (mu) A - 10mA. The device utilizes the injection of electrons from a slightly forward biased and adjacently positioned pn junction into a second hot-carrier avalanching reverse-biased junction. The observed observation is explained in terms of a physical model that propose that direct interband recombination of low energy (cool) electrons recombine or interact with high energy (hot) carrier valance band holes in the silicon indirect bandgap structure. Although the emission is subsurface at this stage, the luminescence intensity appears to be about 250 times brighter than the luminescent intensity resulting from surface emitting Si pn avalanching junctions. The experimental observations and model predicts that the electrical-to-optical power conversion and quantum efficiencies as associated with present Si CMOS LED's may be increased by several orders of magnitude. The present levels of this Si LED is about three to four orders higher than the low frequency detectability of standard pn silicon detector utilizing the same area on chip.
A series of light emitting devices were designed and realized with a standard 2 micron CMOS technology, 1.2 micron CMOS technology and 0.8 micron Bi-CMOS integrated circuit fabrication technology. The devices operated in the reverse breakdown avalanche mode, at voltage levels of 8 - 20 V and in the current range 80 (mu) A - 10 mA. The devices emit visible light in the 450 - 750 nm wavelength region at intensity levels of up to 1 nWmicrometers -2 (10 mW.cm-2). A series of optimized optical detectors were developed using the same technologies in order to detect lateral and glancing incidence visible and infrared radiation optimally. A series of waveguiding structures of up to 100 micron in length were designed and realized with CMOS technologies by utilizing the field oxide, the inter- metallic oxides and the aluminum metal layers as construction elements. Signal levels ranging from 60 nA to 1 micro-amperes could be detected at the detectors of waveguiding structures of up to 100 micron in length. Finally, a complete optoelectronic integrated circuit was designed and simulated with 0.8 micron Bi-CMOS technology with some of the developed light sources, detectors, waveguiding structures and added driving and amplification circuitry. In particular a very powerful high gain wide- bandwidth MOSFET signal amplifiers was developed that could be successfully integrated in the optoelectronic integrated circuit. The developed technologies show potential for application of optoelectronic circuits in next generation silicon CMOS integrated circuits.
Some properties of radiation originating from an avalanching silicon light emitting diode (Si-LED) are dealt with. They are derived from various parts of the spectrum of the Si-LED light. The interdependence of the light output intensity (Li), wavelength ((lambda) ) and reverse current (IR) are determined, as well as the rate of change dLi/d(lambda) and dLi/dIR as a function of (lambda) and IR. The result demonstrate that Li and, to a much lesser extent (lambda) , can be controlled by IR.
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