Dr. Marc Corthout Profile

Dr. Marc Corthout

General Manager at OMC vzw

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Publications (6)

Proceedings Article | 7 April 2011 Paper

Tin LDP source collector module (SoCoMo) ready for integration into Beta scanner

Masaki Yoshioka, Yusuke Teramoto, Jeroen Jonkers, Max Schürmann, Rolf Apetz, Volker Kilian, Marc Corthout

Proceedings Volume 7969, 79691G (2011) https://doi.org/10.1117/12.879386

KEYWORDS: Tin, Scanners, Plasma, Extreme ultraviolet lithography, Extreme ultraviolet, Semiconducting wafers, Light sources, High volume manufacturing, Laser applications, Semiconductors

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As the traditional techniques used in optical photolithography at 193 nm are running out of steam and are becoming prohibitively expensive, a new cost-effective, high power EUV (extreme ultra-violet) light source is needed to enable high volume manufacturing (HVM) of ever shrinking semiconductor devices. XTREME technologies GmbH and EUVA have jointly developed tin based LDP (Laser assisted Discharge Plasma) source systems during the last two years for the integration of such sources into scanners of the latest and future generations. The goals of the consortium are 1) to solve the wavelength gap - the growing gap between the printed critical dimensions (CD) driven by Moore's Law and the printing capability of lithographic exposure tools constrained by the wavelength of the light source - and 2) to enable the timely availability of EUV light sources for high volume manufacturing. A first Beta EUV Source Collector Module (SoCoMo) containing a tin based laser assisted discharge plasma source is in operation at XTREME technologies since September 2009. Alongside the power increase, the main focus of work emphasizes on the improvement of uptime and reliability of the system leveraging years of experience with the Alpha sources. Over the past period, a cumulated EUV dose of several hundreds of Mega Joules of EUV light has been generated at the intermediate focus, capable to expose more than a hundred thousand wafers with the right dose stability to create well-yielding transistors. During the last months, the entire system achieved an uptime - calculated according to the SEMI standards - of up to 80 %. This new SoCoMo has been successfully integrated and tested with a pre-production scanner and is now ready for first wafer exposures at a customer's site. In this paper we will emphasize what our innovative concept is against old type of Xe DPP and we will present the recent status of this system like power level, uptime and lifetime of components as well. In the second part of the paper the EUV source developments for the HVM phase are described. The basic engineering challenges are thermal scaling of the source and debris mitigation. Feasibility of the performance can be demonstrated by experimental results after the implementation into the beta system. The feasibility of further efficiency improvement, required for the HVM phase, will also be shown. The objectives of the HVM roadmap will be achieved through evolutionary steps from the current Beta products.

Proceedings Article | 20 March 2010 Paper

Tin DPP source collector module (SoCoMo): status of Beta products and HVM developments

Masaki Yoshioka, Yusuke Teramoto, Peter Zink, Guido Schriever, Gota Niimi, Marc Corthout

Proceedings Volume 7636, 763610 (2010) https://doi.org/10.1117/12.846545

KEYWORDS: Extreme ultraviolet, Tin, Scanners, Extreme ultraviolet lithography, Plasma, Ultraviolet radiation, Reliability, Semiconducting wafers, Lithography, Electrodes

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Proceedings Article | 18 March 2009 Paper

Xenon DPP source technologies for EUVL exposure tools

Masaki Yoshioka, Denis Bolshukhin, Marc Corthout, Günther Derra, Sven Götze, Jeroen Jonkers, Jürgen Kleinschmidt, Rainer Müller, Max Schürmann, Guido Schriever, Rob Snijkers, Peter Zink

Proceedings Volume 7271, 727109 (2009) https://doi.org/10.1117/12.814100

KEYWORDS: Extreme ultraviolet lithography, Extreme ultraviolet, Xenon, Plasma, Tin, Integrated optics, Scanners, Curtains, Electrodes, Reliability

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Proceedings Article | 4 December 2008 Paper

Status of DPP EUV sources development for Beta/HVM

Masaki Yoshioka, Peter Zink, Guido Schriever, Marc Corthout

Proceedings Volume 7140, 71401F (2008) https://doi.org/10.1117/12.804687

KEYWORDS: Extreme ultraviolet, Extreme ultraviolet lithography, Scanners, Tin, Plasma, Xenon, Energy efficiency, Electrodes, Capacitors, Prototyping

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Proceedings Article | 27 March 2008 Paper

Sn DPP source-collector modules: status of alpha resources, beta developments, and the scalability to HVM

Marc Corthout, Rolf Apetz, Jesko Brudermann, Marcel Damen, Günther Derra, Oliver Franken, Jeroen Jonkers, Jürgen Klein, Felix Küpper, Arnaud Mader, Willi Neff, Hans Scheuermann, Guido Schriever, Max Schürmann, Guido Seimons, Rob Snijkers, Dominik Vaudrevange, Erik Wagenaars, Peiter van de Wel, Masaki Yoshioka, Peter Zink, Oliver Zitzen

Proceedings Volume 6921, 69210V (2008) https://doi.org/10.1117/12.772633

KEYWORDS: Extreme ultraviolet, Tin, Plasma, Pulsed laser operation, Extreme ultraviolet lithography, Astatine, Ultraviolet radiation, Electrodes, Capacitors, Lithography

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Proceedings Article | 3 May 2007 Paper

Status report on EUV source development and EUV source applications in EUVL

Vivek Bakshi, Rainer Lebert, Bernhard Jägle, Christian Wies, Uwe Stamm, Juergen Kleinschmidt, Guido Schriever, Christian Ziener, Marc Corthout, Joseph Pankert, Klaus Bergmann, Willi Neff, André Egbert, Deborah Gustafson

Proceedings Volume 6533, 653315 (2007) https://doi.org/10.1117/12.737183

KEYWORDS: Extreme ultraviolet, Extreme ultraviolet lithography, Xenon, Plasma, Tin, Electrodes, Photomasks, Scanners, Lithography, Mirrors

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Showing 5 of 6 publications

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