Ms. Mari Nozoe Profile

Mari Nozoe

at Hitachi High-Technologies Corp

SPIE Involvement:

Author

Publications (12)

Proceedings Article | 10 April 2013 Paper

In-die overlay metrology method using defect review SEM images

Jaehyoung Oh, Gwangmin Kwon, Daiyoung Mun, Hyungwon Yoo, Sungsu Kim, Tae hui Kim, Minoru Harada, Yohei Minekawa, Fumihiko Fukunaga, Mari Nozoe

Proceedings Volume 8681, 868111 (2013) https://doi.org/10.1117/12.2010728

KEYWORDS: Overlay metrology, Scanning electron microscopy, Semiconducting wafers, Sensors, Image segmentation, Image processing, Error analysis, Measurement devices, Detection and tracking algorithms, Metrology

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Proceedings Article | 5 April 2012 Paper

Application of review-SEM to high-resolution inspection for 3xnm nodes

J. H. Oh, G. Kwon, D. Y. Mun, H. W. Yoo, Y. S. Choi, T. H. Kim, F. Fukunaga, S. Umehara, M. Nozoe

Proceedings Volume 8324, 83242P (2012) https://doi.org/10.1117/12.916244

KEYWORDS: Inspection, Image processing, Scanning electron microscopy, Defect detection, Sensors, Semiconductors, Image resolution, Bridges, Defect inspection, Image sensors

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SPIE Journal Paper | 1 October 2011

Evaluation of extreme ultraviolet mask defect using blank inspection, patterned mask inspection, and wafer inspection

Takashi Kamo, Tsuneo Terasawa, Takeshi Yamane, Hiroyuki Shigemura, Noriaki Takagi, Tsuyoshi Amano, Kazuo Tawarayama, Mari Nozoe, Toshihiko Tanaka, Osamu Suga, Ichiro Mori

JM3, Vol. 10, Issue 04, 043006, (October 2011) https://doi.org/10.1117/12.10.1117/1.3644984

KEYWORDS: Photomasks, Inspection, Defect detection, Extreme ultraviolet, Wafer inspection, Semiconducting wafers, Defect inspection, Extreme ultraviolet lithography, Printing, Multilayers

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Proceedings Article | 20 April 2011 Paper

EB defect inspection of EUV resist patterned wafer for hp 32 nm and beyond

Mari Nozoe, Toshihiko Tanaka, Takashi Kamo, Shinji Kubo, Tomohiro Tamori, Noriaki Takagi, Takeshi Yamane, Tsuneo Terasawa, Hiroyuki Shigemura, Osamu Suga

Proceedings Volume 7971, 797123 (2011) https://doi.org/10.1117/12.879346

KEYWORDS: Inspection, Photomasks, Semiconducting wafers, Defect detection, Extreme ultraviolet, Wafer inspection, Defect inspection, Line width roughness, Image processing, Signal to noise ratio

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Proceedings Article | 29 March 2011 Paper

Evaluation of EUV mask defect using blank inspection, patterned mask inspection, and wafer inspection

Takashi Kamo, Tsuneo Terasawa, Takeshi Yamane, Hiroyuki Shigemura, Noriaki Takagi, Tsuyoshi Amano, Kazuo Tawarayama, Mari Nozoe, Toshihiko Tanaka, Osamu Suga, Ichiro Mori

Proceedings Volume 7969, 79690J (2011) https://doi.org/10.1117/12.879551

KEYWORDS: Photomasks, Inspection, Semiconducting wafers, Wafer inspection, Defect detection, Extreme ultraviolet, Printing, Scanning electron microscopy, Multilayers, Extreme ultraviolet lithography

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SPIE Journal Paper | 1 April 2005

Quantitative scanning electron microscope measurement of resistance of incomplete contact holes in ultralarge scale integrated devices

Hidetoshi Nishiyama, Mari Nozoe

JM3, Vol. 4, Issue 02, 023007, (April 2005) https://doi.org/10.1117/12.10.1117/1.1897388

KEYWORDS: Resistance, Scanning electron microscopy, Electron microscopes, Semiconducting wafers, Electron beams, Inspection, Image processing, Optical simulations, Semiconductors, Silicon

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Proceedings Article | 24 May 2004 Paper

Damage-free metrology of porous low-k dielectrics using CD-SEM

Zhao-Hui Cheng, Mari Nozoe, Makoto Ezumi

Proceedings Volume 5375, (2004) https://doi.org/10.1117/12.533893

KEYWORDS: Dielectrics, Electron beams, Chemical analysis, Metrology, Scanning electron microscopy, Silicon, Thermal effects, Critical dimension metrology, Atomic force microscopy, Semiconducting wafers

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SPIE Journal Paper | 1 July 2003

Advanced inspection technique for deep-submicron and high-aspect-ratio contact holes

Miyako Matsui, Mari Nozoe, Keiko Arauchi, Atsuko Takafuji, Hidetoshi Nishiyama, Yasushi Goto

JM3, Vol. 2, Issue 03, (July 2003) https://doi.org/10.1117/12.10.1117/1.1585062

KEYWORDS: Inspection, Semiconducting wafers, Electron beams, Dry etching, Scanning electron microscopy, Selenium, Silicon, Signal detection, Etching, Linear filtering

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Proceedings Article | 16 July 2002 Paper

Advanced inspection technique for deep-submicron and high-aspect-ratio contact holes

Miyako Matsui, Mari Nozoe, Keiko Arauchi, Atsuko Takafuji, Hidetoshi Nishiyama, Yasushi Goto

Proceedings Volume 4689, (2002) https://doi.org/10.1117/12.473499

KEYWORDS: Inspection, Semiconducting wafers, Electron beams, Selenium, Signal detection, Dry etching, Scanning electron microscopy, Silicon, Semiconductor manufacturing, Process control

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Proceedings Article | 22 August 2001 Paper

Open-contact failure detection of via holes by using voltage contrast

Hidetoshi Nishiyama, Mari Nozoe, Koji Aramaki, Osamu Watanabe, Yoshihiro Ikeda

Proceedings Volume 4344, (2001) https://doi.org/10.1117/12.436736

KEYWORDS: Resistance, Scanning electron microscopy, Semiconducting wafers, Inspection, Electron beams, Information operations, Optical simulations, Neon, Wafer testing, Metals

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Proceedings Article | 2 June 2000 Paper

New voltage-contrast imaging method for detection of electrical failures

Mari Nozoe, Hidetoshi Nishiyama, Hiroyuki Shinada, Maki Tanaka

Proceedings Volume 3998, (2000) https://doi.org/10.1117/12.386512

KEYWORDS: Oxides, Electron beams, Resistance, Inspection, Semiconducting wafers, Imaging systems, Scanning electron microscopy, Transmission electron microscopy, Wafer inspection, Analytical research

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Proceedings Article | 8 June 1998 Paper

Advanced surface inspection techniques for SOI wafers

Mari Nozoe, Aritoshi Sugimoto, Takahide Ikeda

Proceedings Volume 3332, (1998) https://doi.org/10.1117/12.308756

KEYWORDS: Semiconducting wafers, Particles, Inspection, Interference (communication), Surface roughness, Wafer inspection, Thin films, Light scattering, Silicon, Oxygen

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Showing 5 of 12 publications

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