Laser microprocessing using Ultra-Short Pulse lasers has developed thanks to the achieved process quality. The main challenge of those processes is the yield improvement. This study will focus on yield improvement of applications such as such as probe card manufacturing for electronic applications with a green USP laser using beam splitting.
We present here a fully reflective beam splitter compatible with 500fs green lasers. The compatibility with an industrial machine is demonstrated through a F-theta lens, as well as through a precession head. We show here the process results including the repeatability of the pattern, and the achievable ablation rate.
KEYWORDS: Beam splitters, Laser cutting, Laser drilling, Beam shaping, Scanners, Femtosecond phenomena, Laser scanners, 3D scanning, High power lasers, Head
This paper focuses on femtosecond laser cutting and drilling using a patented technology for suppressing the conicity generated by the ablation saturation. We will show that it is now possible to use a high power femtosecond laser, of several hundreds of watts, for zero taper cutting by considering a precession movement on the beam like a donut beam shaping and by applying a beam splitting on this engineered beam to feed several standard scanners.
This paper focuses on femtosecond laser cutting and drilling using a patent pending technology for suppressing the conicity generated by the ablation saturation. We will show that a common scanning system can be used thanks to this technology with a conicity suppression on a scanning field of 20x20mm.
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